HIGH TEMPERATURE DEFORMATION OF Cu-SiO2 ALLOY SINGLE CRYSTALS.

Jun Takada, Masato Shimizu, Masao Adachi

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

To clarify the mechanisms of high temperature deformation of dispersion hardened Cu base alloys, the high temperature deformation behavior of Cu-0. 5 and 1. 0 vol%SiO//2 alloy single crystals was investigated. Tensile tests were performed in the temperature range from 873 to 973 K at initial strain rates between 10** minus **5 and 10** minus **3s** minus **1. The stress exponent, apparent activation energy for high temperature deformation and internal stress were measured. Rotation of the specimen axis was examined by the X-ray Laue method. The results are discussed on the basis of the creep theory of Ansell and Weertman. The stress exponent does not agree with that expected from theory.

Original languageEnglish
Pages (from-to)977-983
Number of pages7
JournalNippon Kinzoku Gakkai-si
Volume45
Issue number9
Publication statusPublished - Jan 1 1981

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

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    Takada, J., Shimizu, M., & Adachi, M. (1981). HIGH TEMPERATURE DEFORMATION OF Cu-SiO2 ALLOY SINGLE CRYSTALS. Nippon Kinzoku Gakkai-si, 45(9), 977-983.