TY - JOUR
T1 - High surface quality micro machining of monocrystalline diamond by picosecond pulsed laser
AU - Okamoto, Y.
AU - Okada, A.
AU - Kajitani, A.
AU - Shinonaga, T.
N1 - Funding Information:
The authors would like to express their sincere thanks to Takahiro Shimose and Koki Tanaka, Nontraditional Machining Laboratory, Okayama University for their contribution to the experiments.
Publisher Copyright:
© 2019
PY - 2019
Y1 - 2019
N2 - In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than Ra = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.
AB - In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than Ra = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.
KW - Diamond
KW - Laser beam machining (LBM)
KW - Laser micro machining
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U2 - 10.1016/j.cirp.2019.04.119
DO - 10.1016/j.cirp.2019.04.119
M3 - Article
AN - SCOPUS:85064922452
VL - 68
SP - 197
EP - 200
JO - CIRP Annals - Manufacturing Technology
JF - CIRP Annals - Manufacturing Technology
SN - 0007-8506
IS - 1
ER -