Abstract
In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than R a = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.
| Original language | English |
|---|---|
| Journal | CIRP Annals |
| DOIs | |
| Publication status | Published - Jan 1 2019 |
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Keywords
- Diamond
- Laser beam machining (LBM)
- Laser micro machining
ASJC Scopus subject areas
- Mechanical Engineering
- Industrial and Manufacturing Engineering
Cite this
High surface quality micro machining of monocrystalline diamond by picosecond pulsed laser. / Okamoto, Yasuhiro; Okada, Akira; Kajitani, A.; Shinonaga, Togo.
In: CIRP Annals, 01.01.2019.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - High surface quality micro machining of monocrystalline diamond by picosecond pulsed laser
AU - Okamoto, Yasuhiro
AU - Okada, Akira
AU - Kajitani, A.
AU - Shinonaga, Togo
PY - 2019/1/1
Y1 - 2019/1/1
N2 - In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than R a = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.
AB - In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than R a = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.
KW - Diamond
KW - Laser beam machining (LBM)
KW - Laser micro machining
UR - http://www.scopus.com/inward/record.url?scp=85064922452&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85064922452&partnerID=8YFLogxK
U2 - 10.1016/j.cirp.2019.04.119
DO - 10.1016/j.cirp.2019.04.119
M3 - Article
AN - SCOPUS:85064922452
JO - CIRP Annals - Manufacturing Technology
JF - CIRP Annals - Manufacturing Technology
SN - 0007-8506
ER -