High surface quality micro machining of monocrystalline diamond by picosecond pulsed laser

Research output: Contribution to journalArticle

Abstract

In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than R a = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.

Original languageEnglish
JournalCIRP Annals
DOIs
Publication statusPublished - Jan 1 2019

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Pulsed lasers
Surface properties
Diamonds
Machining
Surface roughness
Lasers
Polishing
Laser beams
Laser pulses
Cracks
Processing

Keywords

  • Diamond
  • Laser beam machining (LBM)
  • Laser micro machining

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

Cite this

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title = "High surface quality micro machining of monocrystalline diamond by picosecond pulsed laser",
abstract = "In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than R a = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.",
keywords = "Diamond, Laser beam machining (LBM), Laser micro machining",
author = "Yasuhiro Okamoto and Akira Okada and A. Kajitani and Togo Shinonaga",
year = "2019",
month = "1",
day = "1",
doi = "10.1016/j.cirp.2019.04.119",
language = "English",
journal = "CIRP Annals - Manufacturing Technology",
issn = "0007-8506",
publisher = "Elsevier USA",

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AU - Okamoto, Yasuhiro

AU - Okada, Akira

AU - Kajitani, A.

AU - Shinonaga, Togo

PY - 2019/1/1

Y1 - 2019/1/1

N2 - In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than R a = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.

AB - In micro machining of monocrystalline diamond by pulsed laser, unique processing characteristics appeared only under a few ten picosecond pulse duration and a certain overlap rate of laser shot. Cracks mostly propagate in parallel direction to top surface of workpiece, although the laser beam axis is perpendicular to the surface. This processed area can keep diamond structure, and its surface roughness is smaller than R a = 0.2 μm. New laser micro machining method to keep diamond structure and small surface roughness is proposed. This method can contribute to reduce the polishing process in micro machining of diamond.

KW - Diamond

KW - Laser beam machining (LBM)

KW - Laser micro machining

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