High speed, high strength microwelding of Si/glass using ps-laser pulses

Isamu Miyamoto, Yasuhiro Okamoto, Assi Hansen, Joma Vihinen, Tiina Amberla, Jarno Kangastupa

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

A novel microwelding procedure to join Si-to-glass using pslaser pulses with high repetition rates is presented. The procedure provides weld joint with mechanical strength as high as 85 MPa and 45 MPa in sample pairs of Si/aluminosilicate (Si/SW-Y) and Si/borosilicate (Si/Borofloat 33), respectively, which are higher than anodic bonding, at high spatial resolution (<20 μm) and very high throughput without pre- and post-heating. Laser-matter interaction analysis indicates that excellent weld joint of Si/glass is obtained by avoiding violent evaporation of Si substrate using ps-laser pulses. Laser welded Si/glass samples can be singulated along the weld lines by standard blade dicer without defects, demonstrating welding by ps-laser pulses is applicable to wafer-level packaging.

Original languageEnglish
Pages (from-to)3427-3439
Number of pages13
JournalOptics Express
Volume23
Issue number3
DOIs
Publication statusPublished - Feb 9 2015

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high strength
high speed
glass
pulses
lasers
heating
blades
welding
packaging
repetition
spatial resolution
evaporation
wafers
high resolution
defects
interactions

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Miyamoto, I., Okamoto, Y., Hansen, A., Vihinen, J., Amberla, T., & Kangastupa, J. (2015). High speed, high strength microwelding of Si/glass using ps-laser pulses. Optics Express, 23(3), 3427-3439. https://doi.org/10.1364/OE.23.003427

High speed, high strength microwelding of Si/glass using ps-laser pulses. / Miyamoto, Isamu; Okamoto, Yasuhiro; Hansen, Assi; Vihinen, Joma; Amberla, Tiina; Kangastupa, Jarno.

In: Optics Express, Vol. 23, No. 3, 09.02.2015, p. 3427-3439.

Research output: Contribution to journalArticle

Miyamoto, I, Okamoto, Y, Hansen, A, Vihinen, J, Amberla, T & Kangastupa, J 2015, 'High speed, high strength microwelding of Si/glass using ps-laser pulses', Optics Express, vol. 23, no. 3, pp. 3427-3439. https://doi.org/10.1364/OE.23.003427
Miyamoto I, Okamoto Y, Hansen A, Vihinen J, Amberla T, Kangastupa J. High speed, high strength microwelding of Si/glass using ps-laser pulses. Optics Express. 2015 Feb 9;23(3):3427-3439. https://doi.org/10.1364/OE.23.003427
Miyamoto, Isamu ; Okamoto, Yasuhiro ; Hansen, Assi ; Vihinen, Joma ; Amberla, Tiina ; Kangastupa, Jarno. / High speed, high strength microwelding of Si/glass using ps-laser pulses. In: Optics Express. 2015 ; Vol. 23, No. 3. pp. 3427-3439.
@article{9efffd21907145d0a771dcbd3f7e9351,
title = "High speed, high strength microwelding of Si/glass using ps-laser pulses",
abstract = "A novel microwelding procedure to join Si-to-glass using pslaser pulses with high repetition rates is presented. The procedure provides weld joint with mechanical strength as high as 85 MPa and 45 MPa in sample pairs of Si/aluminosilicate (Si/SW-Y) and Si/borosilicate (Si/Borofloat 33), respectively, which are higher than anodic bonding, at high spatial resolution (<20 μm) and very high throughput without pre- and post-heating. Laser-matter interaction analysis indicates that excellent weld joint of Si/glass is obtained by avoiding violent evaporation of Si substrate using ps-laser pulses. Laser welded Si/glass samples can be singulated along the weld lines by standard blade dicer without defects, demonstrating welding by ps-laser pulses is applicable to wafer-level packaging.",
author = "Isamu Miyamoto and Yasuhiro Okamoto and Assi Hansen and Joma Vihinen and Tiina Amberla and Jarno Kangastupa",
year = "2015",
month = "2",
day = "9",
doi = "10.1364/OE.23.003427",
language = "English",
volume = "23",
pages = "3427--3439",
journal = "Optics Express",
issn = "1094-4087",
publisher = "The Optical Society",
number = "3",

}

TY - JOUR

T1 - High speed, high strength microwelding of Si/glass using ps-laser pulses

AU - Miyamoto, Isamu

AU - Okamoto, Yasuhiro

AU - Hansen, Assi

AU - Vihinen, Joma

AU - Amberla, Tiina

AU - Kangastupa, Jarno

PY - 2015/2/9

Y1 - 2015/2/9

N2 - A novel microwelding procedure to join Si-to-glass using pslaser pulses with high repetition rates is presented. The procedure provides weld joint with mechanical strength as high as 85 MPa and 45 MPa in sample pairs of Si/aluminosilicate (Si/SW-Y) and Si/borosilicate (Si/Borofloat 33), respectively, which are higher than anodic bonding, at high spatial resolution (<20 μm) and very high throughput without pre- and post-heating. Laser-matter interaction analysis indicates that excellent weld joint of Si/glass is obtained by avoiding violent evaporation of Si substrate using ps-laser pulses. Laser welded Si/glass samples can be singulated along the weld lines by standard blade dicer without defects, demonstrating welding by ps-laser pulses is applicable to wafer-level packaging.

AB - A novel microwelding procedure to join Si-to-glass using pslaser pulses with high repetition rates is presented. The procedure provides weld joint with mechanical strength as high as 85 MPa and 45 MPa in sample pairs of Si/aluminosilicate (Si/SW-Y) and Si/borosilicate (Si/Borofloat 33), respectively, which are higher than anodic bonding, at high spatial resolution (<20 μm) and very high throughput without pre- and post-heating. Laser-matter interaction analysis indicates that excellent weld joint of Si/glass is obtained by avoiding violent evaporation of Si substrate using ps-laser pulses. Laser welded Si/glass samples can be singulated along the weld lines by standard blade dicer without defects, demonstrating welding by ps-laser pulses is applicable to wafer-level packaging.

UR - http://www.scopus.com/inward/record.url?scp=84922814586&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84922814586&partnerID=8YFLogxK

U2 - 10.1364/OE.23.003427

DO - 10.1364/OE.23.003427

M3 - Article

VL - 23

SP - 3427

EP - 3439

JO - Optics Express

JF - Optics Express

SN - 1094-4087

IS - 3

ER -