High Quality Laser Dicing of Semiconductor Package with a Single-mode Q-switched Fiber Laser "jointly worked"

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)33-38
Number of pages6
JournalInternational Journal of Electrical Machining
Issue number15
Publication statusPublished - 2010

Cite this

@article{b399a235047c43ac94d19732bcfc8cba,
title = "High Quality Laser Dicing of Semiconductor Package with a Single-mode Q-switched Fiber Laser {"}jointly worked{"}",
author = "Yasuhiro Okamoto",
year = "2010",
language = "English",
pages = "33--38",
journal = "International Journal of Electrical Machining",
number = "15",

}

TY - JOUR

T1 - High Quality Laser Dicing of Semiconductor Package with a Single-mode Q-switched Fiber Laser "jointly worked"

AU - Okamoto, Yasuhiro

PY - 2010

Y1 - 2010

M3 - Article

SP - 33

EP - 38

JO - International Journal of Electrical Machining

JF - International Journal of Electrical Machining

IS - 15

ER -