High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser

Hibiki Yamamoto, Yasuhiro Okamoto, Muhamad Fahmi Bin Mohd Noor, Ryoji Kitada, Akira Okada

Research output: Contribution to conferencePaperpeer-review

Fingerprint

Dive into the research topics of 'High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser'. Together they form a unique fingerprint.

Engineering & Materials Science