High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG: YAG laser

Hibiki Yamamoto, Yasuhiro Okamoto, Muhamad Fahmi Bin Mohd Noor, Ryoji Kitada, Akira Okada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.

Original languageEnglish
Title of host publicationProceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011
Publication statusPublished - 2011
Event6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011 - Omiya Sonic City, Saitama, Japan
Duration: Nov 8 2011Nov 10 2011

Other

Other6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011
CountryJapan
CityOmiya Sonic City, Saitama
Period11/8/1111/10/11

Fingerprint

Fiber lasers
Pulsed lasers
Semiconductor materials
Laser beams
Lasers
Laser pulses
Processing
Heat affected zone
Semiconductor devices
Deterioration
Time delay
Hot Temperature

Keywords

  • Fiber laser
  • Laser dicing
  • Semiconductor package
  • SHG:YAG laser
  • Superposition

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Cite this

Yamamoto, H., Okamoto, Y., Bin Mohd Noor, M. F., Kitada, R., & Okada, A. (2011). High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG: YAG laser. In Proceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011

High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG : YAG laser. / Yamamoto, Hibiki; Okamoto, Yasuhiro; Bin Mohd Noor, Muhamad Fahmi; Kitada, Ryoji; Okada, Akira.

Proceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011. 2011.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yamamoto, H, Okamoto, Y, Bin Mohd Noor, MF, Kitada, R & Okada, A 2011, High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG: YAG laser. in Proceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011. 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011, Omiya Sonic City, Saitama, Japan, 11/8/11.
Yamamoto H, Okamoto Y, Bin Mohd Noor MF, Kitada R, Okada A. High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG: YAG laser. In Proceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011. 2011
Yamamoto, Hibiki ; Okamoto, Yasuhiro ; Bin Mohd Noor, Muhamad Fahmi ; Kitada, Ryoji ; Okada, Akira. / High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG : YAG laser. Proceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011. 2011.
@inproceedings{e6e50d1dafb94ba5af72356cb3c5f5b9,
title = "High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG: YAG laser",
abstract = "The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.",
keywords = "Fiber laser, Laser dicing, Semiconductor package, SHG:YAG laser, Superposition",
author = "Hibiki Yamamoto and Yasuhiro Okamoto and {Bin Mohd Noor}, {Muhamad Fahmi} and Ryoji Kitada and Akira Okada",
year = "2011",
language = "English",
booktitle = "Proceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011",

}

TY - GEN

T1 - High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG

T2 - YAG laser

AU - Yamamoto, Hibiki

AU - Okamoto, Yasuhiro

AU - Bin Mohd Noor, Muhamad Fahmi

AU - Kitada, Ryoji

AU - Okada, Akira

PY - 2011

Y1 - 2011

N2 - The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.

AB - The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.

KW - Fiber laser

KW - Laser dicing

KW - Semiconductor package

KW - SHG:YAG laser

KW - Superposition

UR - http://www.scopus.com/inward/record.url?scp=84883353668&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84883353668&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84883353668

BT - Proceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011

ER -