High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser

Hibiki Yamamoto, Yasuhiro Okamoto, Muhamad Fahmi Bin Mohd Noor, Ryoji Kitada, Akira Okada

Research output: Contribution to conferencePaper

Abstract

The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser dicing method by the superposition of fiber laser and SHG:YAG laser was proposed to perform the high-quality processing. The smaller kerf width could be achieved by controlling the time delay between both laser pulses, and the synchronized laser pulses led to the smaller heat affected zone.

Original languageEnglish
Publication statusPublished - Dec 1 2011
Event6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011 - Omiya Sonic City, Saitama, Japan
Duration: Nov 8 2011Nov 10 2011

Other

Other6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011
CountryJapan
CityOmiya Sonic City, Saitama
Period11/8/1111/10/11

Keywords

  • Fiber laser
  • Laser dicing
  • Semiconductor package
  • SHG:YAG laser
  • Superposition

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Fingerprint Dive into the research topics of 'High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser'. Together they form a unique fingerprint.

  • Cite this

    Yamamoto, H., Okamoto, Y., Bin Mohd Noor, M. F., Kitada, R., & Okada, A. (2011). High-quality dicing of semiconductor package by superposition of pulsed fiber laser and SHG:YAG laser. Paper presented at 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011, Omiya Sonic City, Saitama, Japan.