High Performance Slicing Method of Monocrystalline Silicon Ingot by Wire EDM(共著)

Akira Okada

Research output: Contribution to journal › Article

Original languageEnglish
Pages (from-to)219-223
Number of pages5
JournalInitiatines of Precision Engineering at the Beginning of a Millennium
Publication statusPublished - 2000

Cite this

High Performance Slicing Method of Monocrystalline Silicon Ingot by Wire EDM(共著). / Okada, Akira.

In: Initiatines of Precision Engineering at the Beginning of a Millennium, 2000, p. 219-223.

Research output: Contribution to journal › Article

Okada, A 2000, 'High Performance Slicing Method of Monocrystalline Silicon Ingot by Wire EDM(共著)', Initiatines of Precision Engineering at the Beginning of a Millennium, pp. 219-223.
Okada A. High Performance Slicing Method of Monocrystalline Silicon Ingot by Wire EDM(共著). Initiatines of Precision Engineering at the Beginning of a Millennium. 2000;219-223.
Okada, Akira. / High Performance Slicing Method of Monocrystalline Silicon Ingot by Wire EDM(共著). In: Initiatines of Precision Engineering at the Beginning of a Millennium. 2000 ; pp. 219-223.
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