Grinding system reducing the influence of thermal deformation of workpiece in cylindrical grinding

Takashi Onishi, Moriaki Sakakura, Naoki Sato, Takuya Kodani, Kazuhito Oohashi, Shinya Tsukamoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In cylindrical grinding, a sizing device is generally used to obtain the required dimension. However, the dimensional error can be caused by the thermal deformation of the workpiece even if grinding machine is controlled with the sizing device. To solve this problem, it is necessary to develop the grinding system that can consider the thermal deformation of the workpiece during grinding process. In this study, an advanced grinding system was developed, which can predict the net stock removal of ground workpiece immediately. The grinding experiment is carried out to verify the developed system.

Original languageEnglish
Title of host publicationAdvanced Materials Research
Pages609-612
Number of pages4
Volume797
DOIs
Publication statusPublished - 2013
Event16th International Symposium on Advances in Abrasive Technology, ISAAT 2013 and 17th Chinese Conference of Abrasive Technology, CCAT 2013 - Hangzhou, China
Duration: Sep 23 2013Sep 26 2013

Publication series

NameAdvanced Materials Research
Volume797
ISSN (Print)10226680

Other

Other16th International Symposium on Advances in Abrasive Technology, ISAAT 2013 and 17th Chinese Conference of Abrasive Technology, CCAT 2013
CountryChina
CityHangzhou
Period9/23/139/26/13

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Keywords

  • Cylindrical grinding
  • Dimensional error
  • In-process measurement
  • Prediction of thermal deformation
  • Thermal deformation

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Onishi, T., Sakakura, M., Sato, N., Kodani, T., Oohashi, K., & Tsukamoto, S. (2013). Grinding system reducing the influence of thermal deformation of workpiece in cylindrical grinding. In Advanced Materials Research (Vol. 797, pp. 609-612). (Advanced Materials Research; Vol. 797). https://doi.org/10.4028/www.scientific.net/AMR.797.609