Abstract
Single-layered metal bond diamond wheels are useful to high efficient grinding of difficult-to-grind materials because of the high gripping force of abrasive grains and the controllable grain density. In this paper, fundamental information are obtained for an application of electrostatic force to setting of diamond grains into pasted metal bond slurry layer on wheel surface, investigating experimentally jumping phenomenon of diamond grains in an electrostatic field between a electrode plate and metal bond slurry layer. The SD grains and the SDC grains coated with Ti are selected. SDC grains jump into a metal bond layer as quick as making an electrostatic field, however SD grains jump with short time lags. The setting rate of SDC grains is larger than that of SD grains, and setting position accuracy of SDC grain array is better than SD grain array. The possibility of setting abrasive grains into single-layered metal bond diamond wheel surface using electrostatic force is obtained and SDC grains are suitable to the proposed abrasive setting method.
| Original language | English |
|---|---|
| Title of host publication | Advanced Materials Research |
| Pages | 40-45 |
| Number of pages | 6 |
| Volume | 565 |
| DOIs | |
| Publication status | Published - 2012 |
| Event | 15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 - , Singapore Duration: Sep 25 2012 → Sep 28 2012 |
Publication series
| Name | Advanced Materials Research |
|---|---|
| Volume | 565 |
| ISSN (Print) | 10226680 |
Other
| Other | 15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 |
|---|---|
| Country | Singapore |
| Period | 9/25/12 → 9/28/12 |
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Keywords
- Diamond abrasive grain
- Electrostatic force
- Jumping phenomenon
- Single-layered metal bond wheel
ASJC Scopus subject areas
- Engineering(all)
Cite this
Fundamental study on setting of diamond abrasive grains using electrostatic force for single-layered metal bond wheel. / Oohashi, Kazuhito; Yusaku, Kawasuji; Yoshifumi, Shinji; Yoshitaka, Samejima; Soma, Ogawa; Shinya, Tsukamoto.
Advanced Materials Research. Vol. 565 2012. p. 40-45 (Advanced Materials Research; Vol. 565).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Fundamental study on setting of diamond abrasive grains using electrostatic force for single-layered metal bond wheel
AU - Oohashi, Kazuhito
AU - Yusaku, Kawasuji
AU - Yoshifumi, Shinji
AU - Yoshitaka, Samejima
AU - Soma, Ogawa
AU - Shinya, Tsukamoto
PY - 2012
Y1 - 2012
N2 - Single-layered metal bond diamond wheels are useful to high efficient grinding of difficult-to-grind materials because of the high gripping force of abrasive grains and the controllable grain density. In this paper, fundamental information are obtained for an application of electrostatic force to setting of diamond grains into pasted metal bond slurry layer on wheel surface, investigating experimentally jumping phenomenon of diamond grains in an electrostatic field between a electrode plate and metal bond slurry layer. The SD grains and the SDC grains coated with Ti are selected. SDC grains jump into a metal bond layer as quick as making an electrostatic field, however SD grains jump with short time lags. The setting rate of SDC grains is larger than that of SD grains, and setting position accuracy of SDC grain array is better than SD grain array. The possibility of setting abrasive grains into single-layered metal bond diamond wheel surface using electrostatic force is obtained and SDC grains are suitable to the proposed abrasive setting method.
AB - Single-layered metal bond diamond wheels are useful to high efficient grinding of difficult-to-grind materials because of the high gripping force of abrasive grains and the controllable grain density. In this paper, fundamental information are obtained for an application of electrostatic force to setting of diamond grains into pasted metal bond slurry layer on wheel surface, investigating experimentally jumping phenomenon of diamond grains in an electrostatic field between a electrode plate and metal bond slurry layer. The SD grains and the SDC grains coated with Ti are selected. SDC grains jump into a metal bond layer as quick as making an electrostatic field, however SD grains jump with short time lags. The setting rate of SDC grains is larger than that of SD grains, and setting position accuracy of SDC grain array is better than SD grain array. The possibility of setting abrasive grains into single-layered metal bond diamond wheel surface using electrostatic force is obtained and SDC grains are suitable to the proposed abrasive setting method.
KW - Diamond abrasive grain
KW - Electrostatic force
KW - Jumping phenomenon
KW - Single-layered metal bond wheel
UR - http://www.scopus.com/inward/record.url?scp=84869433023&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84869433023&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.565.40
DO - 10.4028/www.scientific.net/AMR.565.40
M3 - Conference contribution
AN - SCOPUS:84869433023
SN - 9783037854679
VL - 565
T3 - Advanced Materials Research
SP - 40
EP - 45
BT - Advanced Materials Research
ER -