Fundamental study on high-quality dicing method for semiconductor package by fiber laser

Ryoji Kitada, Yasuhiro Okamoto, Yoshiyuki Uno, Takuya Ikeda

Research output: Contribution to conferencePaper

Abstract

Recently, the laser dicing method has been expected to replace a blade dicing method because of its high flexibility. However, in the laser dicing, the heat affected zone yielding heat damage should be reduced in order to prevent the deterioration of semiconductor devices consisting of silicon chip. Therefore, the reduction of heat affected zone was experimentally investigated by using cooled assist gas. It is clarified that the combination of nitrogen assist gas in the coaxial direction of laser beam and cooled assist gas from the rear side of cutting direction led to the better cutting results with low heat affected zone.

Original languageEnglish
Pages425-429
Number of pages5
Publication statusPublished - Jan 1 2010
Event16th International Symposium on Electromachining, ISEM 2010 - Shanghai, China
Duration: Apr 19 2010Apr 23 2010

Other

Other16th International Symposium on Electromachining, ISEM 2010
CountryChina
CityShanghai
Period4/19/104/23/10

Keywords

  • Cooled assist gas
  • Heat affected zone
  • High-quality
  • Laser dicing
  • Semiconductor package
  • Single-mode fiber laser

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Fundamental study on high-quality dicing method for semiconductor package by fiber laser'. Together they form a unique fingerprint.

  • Cite this

    Kitada, R., Okamoto, Y., Uno, Y., & Ikeda, T. (2010). Fundamental study on high-quality dicing method for semiconductor package by fiber laser. 425-429. Paper presented at 16th International Symposium on Electromachining, ISEM 2010, Shanghai, China.