Abstract
A new slicing method of monocrystalline silicon ingot using wire electrical discharge machining was proposed for high efficiency and high quality slicing instead of inner diameter blade or multi-wire method. The effects of supply method of working fluid and wire speed on machining characteristics were experimentally investigated. It is clarified that the immersion method is superior than the nozzle supply method and the wire speed over 200 m /min is desirable for stable machining. Besides, mounting of wire sub-guide is useful for obtaining better kerf shape.
Original language | English |
---|---|
Pages | 783-786 |
Number of pages | 4 |
Publication status | Published - 2005 |
Event | 3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 - Nagoya, Japan Duration: Oct 19 2005 → Oct 22 2005 |
Other
Other | 3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 |
---|---|
Country/Territory | Japan |
City | Nagoya |
Period | 10/19/05 → 10/22/05 |
Keywords
- Electrical discharge machining
- Monocrystalline silicon
- Multi-wire
- Slicing
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering