Free-Standing Metal Films Prepared via Electroless Plating at Liquid-Liquid Interfaces

Toshihiko Tsuneyoshi, Yu Yohaze, Takaichi Watanabe, Tsutomu Ono

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

We report a simple preparation of free-standing metal films via electroless plating (ELP) at the liquid-liquid (L-L) interface between an aqueous electroless plating solution and an organic solvent. The use of ELP does not require any external energy in the form of heating and stirring. We find that the affinity of the organic solvent for the palladium nanoparticles (PdNPs) as catalysts and the vertical position of the organic and aqueous phases in the biphasic system are important considerations for synthesizing a robust copper film. Specifically, 1,2-dichloroethane which has an appropriate affinity for PdNPs and a higher density than water was found to be a good candidate for use as the organic phase in this system. However, a poor-quality copper film was obtained in the system with 1-hexanol as the organic phase. We also controlled the microscale surface structure of the copper films by using different concentrations of the injected PdNP dispersion. A high density of PdNPs caused smaller regions of metal growth, which contributed to the formation of smoother metal films. Moreover, under the optimal synthesis condition, we confirmed the electrical conductivity of the obtained copper film to be 1.16 × 10-7 Ωm. We believe that this metal film preparation represents a promising way to produce a range of metal film structures through the use of flexible L-L interfaces as templates.

Original languageEnglish
Pages (from-to)13183-13191
Number of pages9
JournalLangmuir
Volume34
Issue number44
DOIs
Publication statusPublished - Nov 6 2018

Fingerprint

liquid-liquid interfaces
Electroless plating
plating
metal films
palladium
Metals
copper
nanoparticles
Palladium
Liquids
Copper
affinity
Nanoparticles
preparation
Organic solvents
stirring
microbalances
templates
Film preparation
catalysts

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

Cite this

Free-Standing Metal Films Prepared via Electroless Plating at Liquid-Liquid Interfaces. / Tsuneyoshi, Toshihiko; Yohaze, Yu; Watanabe, Takaichi; Ono, Tsutomu.

In: Langmuir, Vol. 34, No. 44, 06.11.2018, p. 13183-13191.

Research output: Contribution to journalArticle

@article{cb9dd810e20f40fcb333d5913a438375,
title = "Free-Standing Metal Films Prepared via Electroless Plating at Liquid-Liquid Interfaces",
abstract = "We report a simple preparation of free-standing metal films via electroless plating (ELP) at the liquid-liquid (L-L) interface between an aqueous electroless plating solution and an organic solvent. The use of ELP does not require any external energy in the form of heating and stirring. We find that the affinity of the organic solvent for the palladium nanoparticles (PdNPs) as catalysts and the vertical position of the organic and aqueous phases in the biphasic system are important considerations for synthesizing a robust copper film. Specifically, 1,2-dichloroethane which has an appropriate affinity for PdNPs and a higher density than water was found to be a good candidate for use as the organic phase in this system. However, a poor-quality copper film was obtained in the system with 1-hexanol as the organic phase. We also controlled the microscale surface structure of the copper films by using different concentrations of the injected PdNP dispersion. A high density of PdNPs caused smaller regions of metal growth, which contributed to the formation of smoother metal films. Moreover, under the optimal synthesis condition, we confirmed the electrical conductivity of the obtained copper film to be 1.16 × 10-7 Ωm. We believe that this metal film preparation represents a promising way to produce a range of metal film structures through the use of flexible L-L interfaces as templates.",
author = "Toshihiko Tsuneyoshi and Yu Yohaze and Takaichi Watanabe and Tsutomu Ono",
year = "2018",
month = "11",
day = "6",
doi = "10.1021/acs.langmuir.8b02822",
language = "English",
volume = "34",
pages = "13183--13191",
journal = "Langmuir",
issn = "0743-7463",
publisher = "American Chemical Society",
number = "44",

}

TY - JOUR

T1 - Free-Standing Metal Films Prepared via Electroless Plating at Liquid-Liquid Interfaces

AU - Tsuneyoshi, Toshihiko

AU - Yohaze, Yu

AU - Watanabe, Takaichi

AU - Ono, Tsutomu

PY - 2018/11/6

Y1 - 2018/11/6

N2 - We report a simple preparation of free-standing metal films via electroless plating (ELP) at the liquid-liquid (L-L) interface between an aqueous electroless plating solution and an organic solvent. The use of ELP does not require any external energy in the form of heating and stirring. We find that the affinity of the organic solvent for the palladium nanoparticles (PdNPs) as catalysts and the vertical position of the organic and aqueous phases in the biphasic system are important considerations for synthesizing a robust copper film. Specifically, 1,2-dichloroethane which has an appropriate affinity for PdNPs and a higher density than water was found to be a good candidate for use as the organic phase in this system. However, a poor-quality copper film was obtained in the system with 1-hexanol as the organic phase. We also controlled the microscale surface structure of the copper films by using different concentrations of the injected PdNP dispersion. A high density of PdNPs caused smaller regions of metal growth, which contributed to the formation of smoother metal films. Moreover, under the optimal synthesis condition, we confirmed the electrical conductivity of the obtained copper film to be 1.16 × 10-7 Ωm. We believe that this metal film preparation represents a promising way to produce a range of metal film structures through the use of flexible L-L interfaces as templates.

AB - We report a simple preparation of free-standing metal films via electroless plating (ELP) at the liquid-liquid (L-L) interface between an aqueous electroless plating solution and an organic solvent. The use of ELP does not require any external energy in the form of heating and stirring. We find that the affinity of the organic solvent for the palladium nanoparticles (PdNPs) as catalysts and the vertical position of the organic and aqueous phases in the biphasic system are important considerations for synthesizing a robust copper film. Specifically, 1,2-dichloroethane which has an appropriate affinity for PdNPs and a higher density than water was found to be a good candidate for use as the organic phase in this system. However, a poor-quality copper film was obtained in the system with 1-hexanol as the organic phase. We also controlled the microscale surface structure of the copper films by using different concentrations of the injected PdNP dispersion. A high density of PdNPs caused smaller regions of metal growth, which contributed to the formation of smoother metal films. Moreover, under the optimal synthesis condition, we confirmed the electrical conductivity of the obtained copper film to be 1.16 × 10-7 Ωm. We believe that this metal film preparation represents a promising way to produce a range of metal film structures through the use of flexible L-L interfaces as templates.

UR - http://www.scopus.com/inward/record.url?scp=85055724014&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85055724014&partnerID=8YFLogxK

U2 - 10.1021/acs.langmuir.8b02822

DO - 10.1021/acs.langmuir.8b02822

M3 - Article

C2 - 30346783

AN - SCOPUS:85055724014

VL - 34

SP - 13183

EP - 13191

JO - Langmuir

JF - Langmuir

SN - 0743-7463

IS - 44

ER -