Finite element analysis for monitoring interface crack between solder ball and copper by direct current potential difference method

Naoya Tada, Takahiro Andou, Toru Kamitani

Research output: Contribution to journalArticle

Abstract

In order to validate the applicability of the direct current potential difference method (DC-PDM) to identification of interface cracks, electric field analysis was carried out for a copper plate with a solder ball joined on the surface by the finite element method. The analysis was carried out for different crack depths under the following four conditions ; (a) when the shape of interface cracks between solder ball and copper changes, (b) when the radius of solder ball changes, (c) when the distance between the bottom of the copper wire and the interface changes, and (d) when the angle of copper wire changes. It was found from the analysis that the larger crack area ratio gave the larger increase in potential difference and that the effect of the crack shape and the angle of copper wire on the potential difference was small. Finally, the relationship between the crack area ratio and the increase in potential difference was given by a single formulated curve for all the conditions discussed in the present analysis.

Original languageEnglish
Pages (from-to)1825-1831
Number of pages7
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume72
Issue number12
Publication statusPublished - Dec 1 2006

Keywords

  • Copper
  • Crack propagation
  • Direct current potential difference method
  • Finite element method
  • Interface crack
  • Nondestructive inspection
  • Solder ball

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Finite element analysis for monitoring interface crack between solder ball and copper by direct current potential difference method'. Together they form a unique fingerprint.

  • Cite this