Finite difference modeling of multiple planes in packages

A. Ege Engin, Madhavan Swaminathan, Yoshitaka Toyota

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

Power/ground planes in electronic packaging can be a major factor for noise coupling. There can be noise coupling not only in the transversal direction between two planes, but also vertically from one plane pair to another through the apertures and via holes. Due to the large size of the power/ground planes, it is difficult to analyze them using full-wave simulators. It is known that the finite difference solution of the Helmholtz equation provides a faster approach with a comparable accuracy. This paper presents new circuit models for a single plane pair based on the finite difference method: T- and X-Models. It also presents a modeling approach for multiple plane pairs that are coupled through apertures.

Original languageEnglish
Title of host publication17th International Zurich Symposium on Electromagnetic Compatibility, 2006
PublisherIEEE Computer Society
Pages549-552
Number of pages4
ISBN (Print)3952299049, 9783952299043
DOIs
Publication statusPublished - Jan 1 2006
Event17th International Zurich Symposium on Electromagnetic Compatibility, 2006 - Singapore, Singapore
Duration: Feb 27 2006Mar 3 2006

Publication series

Name17th International Zurich Symposium on Electromagnetic Compatibility, 2006
Volume2006

Other

Other17th International Zurich Symposium on Electromagnetic Compatibility, 2006
CountrySingapore
CitySingapore
Period2/27/063/3/06

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Engin, A. E., Swaminathan, M., & Toyota, Y. (2006). Finite difference modeling of multiple planes in packages. In 17th International Zurich Symposium on Electromagnetic Compatibility, 2006 (pp. 549-552). [1629683] (17th International Zurich Symposium on Electromagnetic Compatibility, 2006; Vol. 2006). IEEE Computer Society. https://doi.org/10.1109/emczur.2006.214993