Feasibility study of fractal-fin heat sink for improving cooling performance of switching power converters

Shogo Ikegami, Kazuhiro Umetani, Eiji Hiraki, Satoshi Sakai, Satoshi Higashino

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recent progress of the semiconductor switching devices enabled the high-frequency design of the switching power converters, which successfully led to the miniaturization of the circuit elements. However, the heat sink has scarcely been miniaturized during past decades. Now, the heat sinks are one of the major obstacles that hinder further size reduction of the switching power converters. Conventionally, the heat sinks are designed to have a number of flat aluminum fins extending from the aluminum base. However, these flat fins tend to make the laminar airflow passing through the fins. This laminar airflow keeps the air contacting the fin surface to remain on the surface. As a result, the fin surface is covered with the air already heated in the upstream and the fresh open air is prevented from contacting with the fin surface, thus deteriorating the cooling performance of the heat sinks. To overcome this issue, this paper proposes a heat sink structure with a novel fin geometry. The proposed fin geometry incorporates two sizes of the louvers, which are disposed to form a fractal-like pattern. These louvers are intended to break the laminar flow on the fin surface, thus promoting the mixing of the air to improve the cooling performance. FEM simulation of the heat transfer was carried out to verify this concept. The result showed improvement in the heat transfer coefficient, implying the effectiveness of the proposed structure for miniaturization of the heat sink.

Original languageEnglish
Title of host publication2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538653708
DOIs
Publication statusPublished - Jan 14 2019
Event2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Torino, Italy
Duration: Oct 7 2018Oct 11 2018

Publication series

NameINTELEC, International Telecommunications Energy Conference (Proceedings)
Volume2018-October
ISSN (Print)0275-0473

Conference

Conference2018 IEEE International Telecommunications Energy Conference, INTELEC 2018
CountryItaly
CityTorino
Period10/7/1810/11/18

Fingerprint

Fins (heat exchange)
Heat sinks
Power converters
Fractals
Cooling
Air
Aluminum
Geometry
Laminar flow
Heat transfer coefficients
Semiconductor materials
Heat transfer
Finite element method
Networks (circuits)

Keywords

  • Cooling
  • Fin geometry
  • Fractal
  • Heat sink
  • Heat transfer

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Ikegami, S., Umetani, K., Hiraki, E., Sakai, S., & Higashino, S. (2019). Feasibility study of fractal-fin heat sink for improving cooling performance of switching power converters. In 2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings [8612377] (INTELEC, International Telecommunications Energy Conference (Proceedings); Vol. 2018-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INTLEC.2018.8612377

Feasibility study of fractal-fin heat sink for improving cooling performance of switching power converters. / Ikegami, Shogo; Umetani, Kazuhiro; Hiraki, Eiji; Sakai, Satoshi; Higashino, Satoshi.

2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8612377 (INTELEC, International Telecommunications Energy Conference (Proceedings); Vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ikegami, S, Umetani, K, Hiraki, E, Sakai, S & Higashino, S 2019, Feasibility study of fractal-fin heat sink for improving cooling performance of switching power converters. in 2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings., 8612377, INTELEC, International Telecommunications Energy Conference (Proceedings), vol. 2018-October, Institute of Electrical and Electronics Engineers Inc., 2018 IEEE International Telecommunications Energy Conference, INTELEC 2018, Torino, Italy, 10/7/18. https://doi.org/10.1109/INTLEC.2018.8612377
Ikegami S, Umetani K, Hiraki E, Sakai S, Higashino S. Feasibility study of fractal-fin heat sink for improving cooling performance of switching power converters. In 2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8612377. (INTELEC, International Telecommunications Energy Conference (Proceedings)). https://doi.org/10.1109/INTLEC.2018.8612377
Ikegami, Shogo ; Umetani, Kazuhiro ; Hiraki, Eiji ; Sakai, Satoshi ; Higashino, Satoshi. / Feasibility study of fractal-fin heat sink for improving cooling performance of switching power converters. 2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. (INTELEC, International Telecommunications Energy Conference (Proceedings)).
@inproceedings{4689d24b089548e6900c78cc3aaae913,
title = "Feasibility study of fractal-fin heat sink for improving cooling performance of switching power converters",
abstract = "Recent progress of the semiconductor switching devices enabled the high-frequency design of the switching power converters, which successfully led to the miniaturization of the circuit elements. However, the heat sink has scarcely been miniaturized during past decades. Now, the heat sinks are one of the major obstacles that hinder further size reduction of the switching power converters. Conventionally, the heat sinks are designed to have a number of flat aluminum fins extending from the aluminum base. However, these flat fins tend to make the laminar airflow passing through the fins. This laminar airflow keeps the air contacting the fin surface to remain on the surface. As a result, the fin surface is covered with the air already heated in the upstream and the fresh open air is prevented from contacting with the fin surface, thus deteriorating the cooling performance of the heat sinks. To overcome this issue, this paper proposes a heat sink structure with a novel fin geometry. The proposed fin geometry incorporates two sizes of the louvers, which are disposed to form a fractal-like pattern. These louvers are intended to break the laminar flow on the fin surface, thus promoting the mixing of the air to improve the cooling performance. FEM simulation of the heat transfer was carried out to verify this concept. The result showed improvement in the heat transfer coefficient, implying the effectiveness of the proposed structure for miniaturization of the heat sink.",
keywords = "Cooling, Fin geometry, Fractal, Heat sink, Heat transfer",
author = "Shogo Ikegami and Kazuhiro Umetani and Eiji Hiraki and Satoshi Sakai and Satoshi Higashino",
year = "2019",
month = "1",
day = "14",
doi = "10.1109/INTLEC.2018.8612377",
language = "English",
series = "INTELEC, International Telecommunications Energy Conference (Proceedings)",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings",

}

TY - GEN

T1 - Feasibility study of fractal-fin heat sink for improving cooling performance of switching power converters

AU - Ikegami, Shogo

AU - Umetani, Kazuhiro

AU - Hiraki, Eiji

AU - Sakai, Satoshi

AU - Higashino, Satoshi

PY - 2019/1/14

Y1 - 2019/1/14

N2 - Recent progress of the semiconductor switching devices enabled the high-frequency design of the switching power converters, which successfully led to the miniaturization of the circuit elements. However, the heat sink has scarcely been miniaturized during past decades. Now, the heat sinks are one of the major obstacles that hinder further size reduction of the switching power converters. Conventionally, the heat sinks are designed to have a number of flat aluminum fins extending from the aluminum base. However, these flat fins tend to make the laminar airflow passing through the fins. This laminar airflow keeps the air contacting the fin surface to remain on the surface. As a result, the fin surface is covered with the air already heated in the upstream and the fresh open air is prevented from contacting with the fin surface, thus deteriorating the cooling performance of the heat sinks. To overcome this issue, this paper proposes a heat sink structure with a novel fin geometry. The proposed fin geometry incorporates two sizes of the louvers, which are disposed to form a fractal-like pattern. These louvers are intended to break the laminar flow on the fin surface, thus promoting the mixing of the air to improve the cooling performance. FEM simulation of the heat transfer was carried out to verify this concept. The result showed improvement in the heat transfer coefficient, implying the effectiveness of the proposed structure for miniaturization of the heat sink.

AB - Recent progress of the semiconductor switching devices enabled the high-frequency design of the switching power converters, which successfully led to the miniaturization of the circuit elements. However, the heat sink has scarcely been miniaturized during past decades. Now, the heat sinks are one of the major obstacles that hinder further size reduction of the switching power converters. Conventionally, the heat sinks are designed to have a number of flat aluminum fins extending from the aluminum base. However, these flat fins tend to make the laminar airflow passing through the fins. This laminar airflow keeps the air contacting the fin surface to remain on the surface. As a result, the fin surface is covered with the air already heated in the upstream and the fresh open air is prevented from contacting with the fin surface, thus deteriorating the cooling performance of the heat sinks. To overcome this issue, this paper proposes a heat sink structure with a novel fin geometry. The proposed fin geometry incorporates two sizes of the louvers, which are disposed to form a fractal-like pattern. These louvers are intended to break the laminar flow on the fin surface, thus promoting the mixing of the air to improve the cooling performance. FEM simulation of the heat transfer was carried out to verify this concept. The result showed improvement in the heat transfer coefficient, implying the effectiveness of the proposed structure for miniaturization of the heat sink.

KW - Cooling

KW - Fin geometry

KW - Fractal

KW - Heat sink

KW - Heat transfer

UR - http://www.scopus.com/inward/record.url?scp=85061792272&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85061792272&partnerID=8YFLogxK

U2 - 10.1109/INTLEC.2018.8612377

DO - 10.1109/INTLEC.2018.8612377

M3 - Conference contribution

AN - SCOPUS:85061792272

T3 - INTELEC, International Telecommunications Energy Conference (Proceedings)

BT - 2018 IEEE International Telecommunications Energy Conference, INTELEC 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

ER -