Fabrication of a slope failure prediction sensor using miniaturized EC sensor

Masato Futagawa, Mitsuru Komatsu, Hikofumi Suzuki, Yuji Takeshita, Yasushi Fuwa, Kazuaki Sawada

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

To minimize the damage caused by slope failure, knowledge of the increase in water content in mountain soil is important; however the current technology for monitoring this is insufficient. In this study, an EC sensor chip with an insulation layer with increased thickness, designed to reduce leakage current, was fabricated. Utilizing the chip, a wireless sensor terminal was constructed for long term continuous monitoring of the water content in mountain soil. The usefulness of the EC sensor for predicting slope failure was confirmed.

Original languageEnglish
Pages (from-to)278-283+5
JournalIEEJ Transactions on Sensors and Micromachines
Volume133
Issue number9
DOIs
Publication statusPublished - Oct 7 2013

    Fingerprint

Keywords

  • EC sensor
  • On-site monitoring
  • Prediction
  • Slope failure
  • Water content of soil
  • Wireless networks

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this