TY - GEN
T1 - Fabrication of a low leakage current type impedance sensor to monitor soil water content for slope failure prognostics
AU - Futagawa, Masato
AU - Ogasahara, Shin
AU - Ito, Tatsumi
AU - Komatsu, Mitsuru
AU - Fuwa, Yasushi
AU - Hirano, Harutoyo
AU - Akita, Ippei
AU - Kusano, Kenichiro
AU - Watanabe, Minoru
N1 - Funding Information:
This work was partially supported by Grant-in-Aid for Young Scientists (B), Grant Number 24760277, of Japan Society for the Promotion of Science (JSPS), the Ministry of Internal Affairs and Communications’ Strategic Information and Communications R&D Promotion Program (SCOPE) within 2014-2016, and Fiscal 2014 Sekisui Chemical Grants for Research on Manufacturing Based on Innovations Inspired by Nature. The authors wish to acknowledge Dr. Kazuaki Sawada, Professor of Toyohashi University of Technology, for advice on sensor chip fabrication.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/26
Y1 - 2017/7/26
N2 - A low-leakage-current type impedance sensor chip with shield structures has been fabricated. The low limit detection of soil-water-content measurement was improved compared with that of the other semiconductor type sensors. The shield structures were fabricated under the impedance sensor areas. To measure weak signal current eliminated the leakage current, we proposed a new operation circuit to separate the leakage current. Our sensor achieved to measure low water content 10 % or less.
AB - A low-leakage-current type impedance sensor chip with shield structures has been fabricated. The low limit detection of soil-water-content measurement was improved compared with that of the other semiconductor type sensors. The shield structures were fabricated under the impedance sensor areas. To measure weak signal current eliminated the leakage current, we proposed a new operation circuit to separate the leakage current. Our sensor achieved to measure low water content 10 % or less.
KW - Impedance sensor
KW - slope failure prognostics
KW - soil water content
UR - http://www.scopus.com/inward/record.url?scp=85029387900&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85029387900&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2017.7994253
DO - 10.1109/TRANSDUCERS.2017.7994253
M3 - Conference contribution
AN - SCOPUS:85029387900
T3 - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
SP - 1136
EP - 1139
BT - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
Y2 - 18 June 2017 through 22 June 2017
ER -