Fabrication of a hydrophilic property impedance sensor to stably monitor soil water content for slope failure prognostics

Masato Futagawa, Tatsumi Ito, Arumi Kunii, Minoru Watanabe, Hikofumi Suzuki, Yasushi Fuwa, Yuji Takeshita, Mitsuru Komatsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

To minimize the damage caused by slope failure, knowledge of the increase in water content in mountain soil is important. Our group has been studying miniaturized impedance sensor for multipoint measurements in the soil. To improve contact characteristics between sensor surface and free water in soil, SiOx film of hydrophilic property covered on our conventional sensor chip. For contact property test, the sensor chip measured impedance of model soils. The proposed sensor achieved to stable contact the free water in the soil. Moreover, the chip operated for long period of time in mountain slope. The sensor could measure nearly theoretical outputs which responded to rainfalls. We succeeded to fabricate the stably soil monitor sensor with hydrophilic film SiOx.

Original languageEnglish
Title of host publication2015 IEEE SENSORS - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479982028
DOIs
Publication statusPublished - Dec 31 2015
Event14th IEEE SENSORS - Busan, Korea, Republic of
Duration: Nov 1 2015Nov 4 2015

Other

Other14th IEEE SENSORS
CountryKorea, Republic of
CityBusan
Period11/1/1511/4/15

Keywords

  • Hydrophilic film
  • Impedance sensor
  • slope failure
  • soil
  • water content

ASJC Scopus subject areas

  • Instrumentation
  • Electronic, Optical and Magnetic Materials
  • Spectroscopy
  • Electrical and Electronic Engineering

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  • Cite this

    Futagawa, M., Ito, T., Kunii, A., Watanabe, M., Suzuki, H., Fuwa, Y., Takeshita, Y., & Komatsu, M. (2015). Fabrication of a hydrophilic property impedance sensor to stably monitor soil water content for slope failure prognostics. In 2015 IEEE SENSORS - Proceedings [7370547] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSENS.2015.7370547