Evaluation of tensile strength of copper-cored lead-free solder joints in air, distilled water, and NaCl solution using testing device with permanent magnets

Naoya Tada, Hiroyasu Masago

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Solder joints have been used for electric connections in many electric devices. Since the electric devices are subjected to various loadings such as static, cyclic, and thermal stresses, the evaluation of solder joint strength under these conditions is necessary to guarantee the safety of electric devices. In addition, the electric devices are extending their application field and are used in corrosive conditions such as high humid and saline environments. The strength of solder joints under these conditions is also important. In this paper, tensile tests of copper-cored lead-free solder ball and nickel rod joints were carried out in air, distilled water, and salt water environments using a unique tensile testing device with permanent magnet. The joint strength and fracture behavior were discussed.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages92-95
Number of pages4
ISBN (Electronic)9781479977277
DOIs
Publication statusPublished - Jan 1 2014
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan, Province of China
Duration: Oct 22 2014Oct 24 2014

Publication series

Name2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
CountryTaiwan, Province of China
CityTaipei
Period10/22/1410/24/14

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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    Tada, N., & Masago, H. (2014). Evaluation of tensile strength of copper-cored lead-free solder joints in air, distilled water, and NaCl solution using testing device with permanent magnets. In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings (pp. 92-95). [7048368] (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2014.7048368