Evaluation of interface crack between solder ball and copper based on the non-destructive monitoring of direct current potential difference

Naoya Tada, Takahiro Andou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An evaluation method of interface crack between solder ball and copper based on the non-destructive monitoring of direct current potential difference was proposed. The validity of the method was examined based on the results of electric field analysis by the finite element method. In the analysis, it was assumed that a solder ball was simply joined on the surface of a copper plate and the interface crack was evaluated by the potential difference between the top of the wire inserted into the solder ball and the copper plate. It was found from the analysis that the relationship between the crack area ratio and the increase in the potential difference was given by a single formula for all the conditions assumed in this study. As an experimental verification, a cyclic tensile test was carried out for the interface between Sn-3Ag-0.5Cu lead-free solder balls and a plate specimen of pure copper. Similar relationship between the crack area ratio and the increase in the potential difference held for the test. This suggests that the proposed method is applicable to the evaluation of actual interface cracks initiated in the specimens or in various electric packages.

Original languageEnglish
Title of host publication2006 International Conference on Electronic Materials and Packaging, EMAP
DOIs
Publication statusPublished - 2006
Event2006 International Conference on Electronic Materials and Packaging, EMAP - Kowloon, China
Duration: Dec 11 2006Dec 14 2006

Other

Other2006 International Conference on Electronic Materials and Packaging, EMAP
CountryChina
CityKowloon
Period12/11/0612/14/06

Fingerprint

Soldering alloys
Cracks
Copper
Monitoring
Electric fields
Wire
Finite element method

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Evaluation of interface crack between solder ball and copper based on the non-destructive monitoring of direct current potential difference. / Tada, Naoya; Andou, Takahiro.

2006 International Conference on Electronic Materials and Packaging, EMAP. 2006. 4430649.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tada, N & Andou, T 2006, Evaluation of interface crack between solder ball and copper based on the non-destructive monitoring of direct current potential difference. in 2006 International Conference on Electronic Materials and Packaging, EMAP., 4430649, 2006 International Conference on Electronic Materials and Packaging, EMAP, Kowloon, China, 12/11/06. https://doi.org/10.1109/EMAP.2006.4430649
Tada, Naoya ; Andou, Takahiro. / Evaluation of interface crack between solder ball and copper based on the non-destructive monitoring of direct current potential difference. 2006 International Conference on Electronic Materials and Packaging, EMAP. 2006.
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