Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests

Naoya Tada, Takuhiro Tanaka, Hirotsugu Tabata, Takeshi Uemori, Toshiya Nakata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recently, copper wires have been attracting much attention for LSI (Large Scale Integration) bonding because of its excellent mechanical and electrical properties, and low material cost. On the other hand, the end of these wires are usually joined to the pads or through-holes on the printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the solders are weaker than copper wires, the stress and strain tend to be concentrated on the interface of solder/wire interface. The fracture frequently occurred there and may influence the quality of product. It is therefore important to evaluate the bonding strength of thin copper wire and lead-free solder. In this paper, pullout tests of thin copper wires from lead-free solder were carried out and the pullout behavior of the wires were observed. A method of bonding strength evaluation was proposed and the results were examined.

Original languageEnglish
Title of host publication11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings
PublisherIEEE Computer Society
Pages164-167
Number of pages4
ISBN (Electronic)9781509047697
DOIs
Publication statusPublished - Dec 27 2016
Event11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Taipei, Taiwan, Province of China
Duration: Oct 26 2016Oct 28 2016

Other

Other11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016
CountryTaiwan, Province of China
CityTaipei
Period10/26/1610/28/16

Fingerprint

Wire
Copper
Soldering alloys
LSI circuits
Soldering
Lead-free solders
Printed circuit boards
Electric properties
Lead
Mechanical properties
Costs

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Tada, N., Tanaka, T., Tabata, H., Uemori, T., & Nakata, T. (2016). Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests. In 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings (pp. 164-167). [7799989] IEEE Computer Society. https://doi.org/10.1109/IMPACT.2016.7799989

Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests. / Tada, Naoya; Tanaka, Takuhiro; Tabata, Hirotsugu; Uemori, Takeshi; Nakata, Toshiya.

11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, 2016. p. 164-167 7799989.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tada, N, Tanaka, T, Tabata, H, Uemori, T & Nakata, T 2016, Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests. in 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings., 7799989, IEEE Computer Society, pp. 164-167, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016, Taipei, Taiwan, Province of China, 10/26/16. https://doi.org/10.1109/IMPACT.2016.7799989
Tada N, Tanaka T, Tabata H, Uemori T, Nakata T. Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests. In 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society. 2016. p. 164-167. 7799989 https://doi.org/10.1109/IMPACT.2016.7799989
Tada, Naoya ; Tanaka, Takuhiro ; Tabata, Hirotsugu ; Uemori, Takeshi ; Nakata, Toshiya. / Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests. 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, 2016. pp. 164-167
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