Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests

Naoya Tada; Takuhiro Tanaka; Hirotsugu Tabata; Takeshi Uemori; Toshiya Nakata

doi:10.1109/IMPACT.2016.7799989

Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests

Naoya Tada, Takuhiro Tanaka, Hirotsugu Tabata, Takeshi Uemori, Toshiya Nakata

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Recently, copper wires have been attracting much attention for LSI (Large Scale Integration) bonding because of its excellent mechanical and electrical properties, and low material cost. On the other hand, the end of these wires are usually joined to the pads or through-holes on the printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the solders are weaker than copper wires, the stress and strain tend to be concentrated on the interface of solder/wire interface. The fracture frequently occurred there and may influence the quality of product. It is therefore important to evaluate the bonding strength of thin copper wire and lead-free solder. In this paper, pullout tests of thin copper wires from lead-free solder were carried out and the pullout behavior of the wires were observed. A method of bonding strength evaluation was proposed and the results were examined.

Original language	English
Title of host publication	11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings
Publisher	IEEE Computer Society
Pages	164-167
Number of pages	4
ISBN (Electronic)	9781509047697
DOIs	https://doi.org/10.1109/IMPACT.2016.7799989
Publication status	Published - Dec 27 2016
Event	11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Taipei, Taiwan, Province of China Duration: Oct 26 2016 → Oct 28 2016

Other

Other	11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016
Country/Territory	Taiwan, Province of China
City	Taipei
Period	10/26/16 → 10/28/16

ASJC Scopus subject areas

Hardware and Architecture
Control and Systems Engineering
Electrical and Electronic Engineering

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10.1109/IMPACT.2016.7799989

Cite this

Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests. / Tada, Naoya; Tanaka, Takuhiro; Tabata, Hirotsugu et al.

11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, 2016. p. 164-167 7799989.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Tada, N, Tanaka, T, Tabata, H, Uemori, T & Nakata, T 2016, Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests. in 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings., 7799989, IEEE Computer Society, pp. 164-167, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016, Taipei, Taiwan, Province of China, 10/26/16. https://doi.org/10.1109/IMPACT.2016.7799989

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abstract = "Recently, copper wires have been attracting much attention for LSI (Large Scale Integration) bonding because of its excellent mechanical and electrical properties, and low material cost. On the other hand, the end of these wires are usually joined to the pads or through-holes on the printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the solders are weaker than copper wires, the stress and strain tend to be concentrated on the interface of solder/wire interface. The fracture frequently occurred there and may influence the quality of product. It is therefore important to evaluate the bonding strength of thin copper wire and lead-free solder. In this paper, pullout tests of thin copper wires from lead-free solder were carried out and the pullout behavior of the wires were observed. A method of bonding strength evaluation was proposed and the results were examined.",

author = "Naoya Tada and Takuhiro Tanaka and Hirotsugu Tabata and Takeshi Uemori and Toshiya Nakata",

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AU - Nakata, Toshiya

PY - 2016/12/27

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N2 - Recently, copper wires have been attracting much attention for LSI (Large Scale Integration) bonding because of its excellent mechanical and electrical properties, and low material cost. On the other hand, the end of these wires are usually joined to the pads or through-holes on the printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the solders are weaker than copper wires, the stress and strain tend to be concentrated on the interface of solder/wire interface. The fracture frequently occurred there and may influence the quality of product. It is therefore important to evaluate the bonding strength of thin copper wire and lead-free solder. In this paper, pullout tests of thin copper wires from lead-free solder were carried out and the pullout behavior of the wires were observed. A method of bonding strength evaluation was proposed and the results were examined.

AB - Recently, copper wires have been attracting much attention for LSI (Large Scale Integration) bonding because of its excellent mechanical and electrical properties, and low material cost. On the other hand, the end of these wires are usually joined to the pads or through-holes on the printed circuit board, and lead-free soldering is one of the popular bonding methods. Since the solders are weaker than copper wires, the stress and strain tend to be concentrated on the interface of solder/wire interface. The fracture frequently occurred there and may influence the quality of product. It is therefore important to evaluate the bonding strength of thin copper wire and lead-free solder. In this paper, pullout tests of thin copper wires from lead-free solder were carried out and the pullout behavior of the wires were observed. A method of bonding strength evaluation was proposed and the results were examined.

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Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests

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