Evaluation of 3-dimensional plastic strain of grains in polycrystalline copper during tension by EBSD method and digital image processing

Ryouji Kondou, Takeji Abe, Naoya Tada

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

A method of evaluation of six components of grain strain in polycrystalline metal was proposed. In the present method, the electron backscattered diffraction (EBSD) technique and the digital image processing were efficiently combined. Four components of grain strain, εx, εy;, εz and γxy were evaluated based on the change in average aspect ratio of the number of pixels inside the grain which was obtained by an optical microscope and digital image analysis, where xy-plane is set on the specimen surface and z-axis is directed perpendicularly to the surface. The other two components, γyz, γzx, were calculated by taking into consideration the restriction of plastic deformation of each grain which was derived on the assumption that the plastic deformation occurred by crystallographic slipping on a single set of slip plane. An angle of the slip planes was 3-dimensionally identified by observation of the slip line by a scanning electron microscope and EBSD technique. Grain strain of polycrystalline copper during tension was evaluated by the proposed method and the results were discussed from the viewpoints of the distribution of grain strains and the deformation restriction by neighboring grains.

Original languageEnglish
Pages (from-to)972-979
Number of pages8
JournalNippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume69
Issue number6
DOIs
Publication statusPublished - Jun 2003
Externally publishedYes

Keywords

  • Digital image processing
  • EBSD method
  • Plastic strain
  • Plasticity
  • Polycrystalline copper
  • Restriction of deformation
  • Slip plane
  • Tension

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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