Original language | English |
---|---|
Pages (from-to) | 707-712 |
Number of pages | 6 |
Journal | Proceedings of 13th International Symposium on Electronics Packaging (ICEP2013) |
Publication status | Published - 2013 |
Electromagnetic Simulation of Printed Circuit Board Adjacent to Conductor Using Equivalent Model Focusing on Common-mode
Research output: Contribution to journal › Article