Electromagnetic immunity analysis using modal-equivalent circuit in cable interconnection system

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electromagnetic immunity analysis as well as electromagnetic emission analysis is significant for EMC design. In this paper, we apply a modal equivalent-circuit model with mode-conversion sources to electromagnetic immunity analysis in a simple cable interconnection system. The analysis can treat mode conversion caused by discontinuity in multi-conductor transmission line with circuit analysis and has been validated in electromagnetic emission analysis. The approach takes an advantage in less calculation sources and helps get design considerations compared with full-wave simulation. In this paper, common-mode excitation by a current probe in a simple cable interconnection system is investigated for model validation. As a result, it is demonstrated that the circuit analysis with the modal-equivalent circuit model agrees well with the measurement results.

Original languageEnglish
Title of host publication2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages716-719
Number of pages4
ISBN (Print)9781479966707
DOIs
Publication statusPublished - Aug 3 2015
EventAsia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 - Taipei, Taiwan, Province of China
Duration: May 25 2015May 29 2015

Other

OtherAsia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
CountryTaiwan, Province of China
CityTaipei
Period5/25/155/29/15

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Radiation

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  • Cite this

    Toyota, Y., Iokibe, K., & Koga, L. R. (2015). Electromagnetic immunity analysis using modal-equivalent circuit in cable interconnection system. In 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 (pp. 716-719). [7175388] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEMC.2015.7175388