Abstract
Electromagnetic immunity analysis as well as electromagnetic emission analysis is significant for EMC design. In this paper, we apply a modal equivalent-circuit model with mode-conversion sources to electromagnetic immunity analysis in a simple cable interconnection system. The analysis can treat mode conversion caused by discontinuity in multi-conductor transmission line with circuit analysis and has been validated in electromagnetic emission analysis. The approach takes an advantage in less calculation sources and helps get design considerations compared with full-wave simulation. In this paper, common-mode excitation by a current probe in a simple cable interconnection system is investigated for model validation. As a result, it is demonstrated that the circuit analysis with the modal-equivalent circuit model agrees well with the measurement results.
| Original language | English |
|---|---|
| Title of host publication | 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 716-719 |
| Number of pages | 4 |
| ISBN (Print) | 9781479966707 |
| DOIs | |
| Publication status | Published - Aug 3 2015 |
| Event | Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 - Taipei, Taiwan, Province of China Duration: May 25 2015 → May 29 2015 |
Other
| Other | Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 |
|---|---|
| Country | Taiwan, Province of China |
| City | Taipei |
| Period | 5/25/15 → 5/29/15 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Radiation
Cite this
Electromagnetic immunity analysis using modal-equivalent circuit in cable interconnection system. / Toyota, Yoshitaka; Iokibe, Kengo; Koga, Liuji R.
2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 716-719 7175388.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Electromagnetic immunity analysis using modal-equivalent circuit in cable interconnection system
AU - Toyota, Yoshitaka
AU - Iokibe, Kengo
AU - Koga, Liuji R.
PY - 2015/8/3
Y1 - 2015/8/3
N2 - Electromagnetic immunity analysis as well as electromagnetic emission analysis is significant for EMC design. In this paper, we apply a modal equivalent-circuit model with mode-conversion sources to electromagnetic immunity analysis in a simple cable interconnection system. The analysis can treat mode conversion caused by discontinuity in multi-conductor transmission line with circuit analysis and has been validated in electromagnetic emission analysis. The approach takes an advantage in less calculation sources and helps get design considerations compared with full-wave simulation. In this paper, common-mode excitation by a current probe in a simple cable interconnection system is investigated for model validation. As a result, it is demonstrated that the circuit analysis with the modal-equivalent circuit model agrees well with the measurement results.
AB - Electromagnetic immunity analysis as well as electromagnetic emission analysis is significant for EMC design. In this paper, we apply a modal equivalent-circuit model with mode-conversion sources to electromagnetic immunity analysis in a simple cable interconnection system. The analysis can treat mode conversion caused by discontinuity in multi-conductor transmission line with circuit analysis and has been validated in electromagnetic emission analysis. The approach takes an advantage in less calculation sources and helps get design considerations compared with full-wave simulation. In this paper, common-mode excitation by a current probe in a simple cable interconnection system is investigated for model validation. As a result, it is demonstrated that the circuit analysis with the modal-equivalent circuit model agrees well with the measurement results.
UR - http://www.scopus.com/inward/record.url?scp=84964033479&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84964033479&partnerID=8YFLogxK
U2 - 10.1109/APEMC.2015.7175388
DO - 10.1109/APEMC.2015.7175388
M3 - Conference contribution
AN - SCOPUS:84964033479
SN - 9781479966707
SP - 716
EP - 719
BT - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
ER -