Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary

Innocent C. Ezenwa, Richard A. Secco, Wenjun Yong, Monica Pozzo, Dario Alfè

Research output: Contribution to journalArticlepeer-review

24 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds