Abstract
The electrical resistivity of high purity Cu has been investigated by both experiments and first principle calculations at pressures up to 5 GPa and at temperatures in the liquid phase up to 1730 K. The resistivity decreases with P and increases with T and our data are in very good agreement in relation to 1 atm data. Our melting temperature data agree with other experimental studies. We show that resistivity of Cu decreases along the P,T-dependent melting boundary in disagreement with prediction of resistivity invariance along the melting boundary. These findings are interpreted in terms of the competing effects of P and T on the electronic structure of liquid Cu. The electronic thermal conductivity is calculated from resistivity data using the Wiedemann-Franz law and is shown to increase with P in both the solid and liquid states but upon T increase, it decreases in the solid and increases in the liquid state.
Original language | English |
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Pages (from-to) | 386-393 |
Number of pages | 8 |
Journal | Journal of Physics and Chemistry of Solids |
Volume | 110 |
DOIs | |
Publication status | Published - Nov 1 2017 |
Externally published | Yes |
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ASJC Scopus subject areas
- Chemistry(all)
- Materials Science(all)
- Condensed Matter Physics
Cite this
Electrical resistivity of solid and liquid Cu up to 5 GPa : Decrease along the melting boundary. / Ezenwa, Innocent; Secco, Richard A.; Yong, Wenjun; Pozzo, Monica; Alfè, Dario.
In: Journal of Physics and Chemistry of Solids, Vol. 110, 01.11.2017, p. 386-393.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Electrical resistivity of solid and liquid Cu up to 5 GPa
T2 - Decrease along the melting boundary
AU - Ezenwa, Innocent
AU - Secco, Richard A.
AU - Yong, Wenjun
AU - Pozzo, Monica
AU - Alfè, Dario
PY - 2017/11/1
Y1 - 2017/11/1
N2 - The electrical resistivity of high purity Cu has been investigated by both experiments and first principle calculations at pressures up to 5 GPa and at temperatures in the liquid phase up to 1730 K. The resistivity decreases with P and increases with T and our data are in very good agreement in relation to 1 atm data. Our melting temperature data agree with other experimental studies. We show that resistivity of Cu decreases along the P,T-dependent melting boundary in disagreement with prediction of resistivity invariance along the melting boundary. These findings are interpreted in terms of the competing effects of P and T on the electronic structure of liquid Cu. The electronic thermal conductivity is calculated from resistivity data using the Wiedemann-Franz law and is shown to increase with P in both the solid and liquid states but upon T increase, it decreases in the solid and increases in the liquid state.
AB - The electrical resistivity of high purity Cu has been investigated by both experiments and first principle calculations at pressures up to 5 GPa and at temperatures in the liquid phase up to 1730 K. The resistivity decreases with P and increases with T and our data are in very good agreement in relation to 1 atm data. Our melting temperature data agree with other experimental studies. We show that resistivity of Cu decreases along the P,T-dependent melting boundary in disagreement with prediction of resistivity invariance along the melting boundary. These findings are interpreted in terms of the competing effects of P and T on the electronic structure of liquid Cu. The electronic thermal conductivity is calculated from resistivity data using the Wiedemann-Franz law and is shown to increase with P in both the solid and liquid states but upon T increase, it decreases in the solid and increases in the liquid state.
UR - http://www.scopus.com/inward/record.url?scp=85021917159&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85021917159&partnerID=8YFLogxK
U2 - 10.1016/j.jpcs.2017.06.030
DO - 10.1016/j.jpcs.2017.06.030
M3 - Article
AN - SCOPUS:85021917159
VL - 110
SP - 386
EP - 393
JO - Journal of Physics and Chemistry of Solids
JF - Journal of Physics and Chemistry of Solids
SN - 0022-3697
ER -