Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary

Innocent Ezenwa, Richard A. Secco, Wenjun Yong, Monica Pozzo, Dario Alfè

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

The electrical resistivity of high purity Cu has been investigated by both experiments and first principle calculations at pressures up to 5 GPa and at temperatures in the liquid phase up to 1730 K. The resistivity decreases with P and increases with T and our data are in very good agreement in relation to 1 atm data. Our melting temperature data agree with other experimental studies. We show that resistivity of Cu decreases along the P,T-dependent melting boundary in disagreement with prediction of resistivity invariance along the melting boundary. These findings are interpreted in terms of the competing effects of P and T on the electronic structure of liquid Cu. The electronic thermal conductivity is calculated from resistivity data using the Wiedemann-Franz law and is shown to increase with P in both the solid and liquid states but upon T increase, it decreases in the solid and increases in the liquid state.

Original languageEnglish
Pages (from-to)386-393
Number of pages8
JournalJournal of Physics and Chemistry of Solids
Volume110
DOIs
Publication statusPublished - Nov 1 2017
Externally publishedYes

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Melting
melting
electrical resistivity
Liquids
liquids
Invariance
Electronic structure
Melting point
Thermal conductivity
invariance
purity
liquid phases
thermal conductivity
electronic structure
solid state
temperature
predictions
electronics
Experiments
Temperature

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Electrical resistivity of solid and liquid Cu up to 5 GPa : Decrease along the melting boundary. / Ezenwa, Innocent; Secco, Richard A.; Yong, Wenjun; Pozzo, Monica; Alfè, Dario.

In: Journal of Physics and Chemistry of Solids, Vol. 110, 01.11.2017, p. 386-393.

Research output: Contribution to journalArticle

Ezenwa, Innocent ; Secco, Richard A. ; Yong, Wenjun ; Pozzo, Monica ; Alfè, Dario. / Electrical resistivity of solid and liquid Cu up to 5 GPa : Decrease along the melting boundary. In: Journal of Physics and Chemistry of Solids. 2017 ; Vol. 110. pp. 386-393.
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