Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary

Innocent C. Ezenwa, Richard A. Secco, Wenjun Yong, Monica Pozzo, Dario Alfè

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)


The electrical resistivity of high purity Cu has been investigated by both experiments and first principle calculations at pressures up to 5 GPa and at temperatures in the liquid phase up to 1730 K. The resistivity decreases with P and increases with T and our data are in very good agreement in relation to 1 atm data. Our melting temperature data agree with other experimental studies. We show that resistivity of Cu decreases along the P,T-dependent melting boundary in disagreement with prediction of resistivity invariance along the melting boundary. These findings are interpreted in terms of the competing effects of P and T on the electronic structure of liquid Cu. The electronic thermal conductivity is calculated from resistivity data using the Wiedemann-Franz law and is shown to increase with P in both the solid and liquid states but upon T increase, it decreases in the solid and increases in the liquid state.

Original languageEnglish
Pages (from-to)386-393
Number of pages8
JournalJournal of Physics and Chemistry of Solids
Publication statusPublished - Nov 2017
Externally publishedYes

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics


Dive into the research topics of 'Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary'. Together they form a unique fingerprint.

Cite this