TY - GEN
T1 - Effect of sendust particle size on absorption characteristics of composite electromagnetic wave absorber
AU - Sakai, Kenji
AU - Wada, Yoichi
AU - Sato, Yuuki
AU - Yoshikado, Shinzo
PY - 2010/1/1
Y1 - 2010/1/1
N2 - The effects of the particle size of sendust, which is an alloy of Al 5%, Si 10%, and Fe 85%, on the absorption characteristics of composite electromagnetic wave absorbers made of polystyrene resin and sendust were investigated in the frequency range from 1 to 40 GHz. The size of sendust particles was varied between approximately 5 and 20 μm. A metal-backed single-layer absorber made of 20 μm sendust particles absorbed more than 99% of electromagnetic wave power at frequencies above 20 GHz. Meanwhile, a composite made of 5 μm particles exhibited a return loss of less than -20 dB in the frequency range of not only several GHz but also above 30 GHz. In addition, the relative complex permeability μr * was shown to be controlled by adjusting the particle size of sendust, and an electromagnetic wave absorber with a flexible design was proposed.
AB - The effects of the particle size of sendust, which is an alloy of Al 5%, Si 10%, and Fe 85%, on the absorption characteristics of composite electromagnetic wave absorbers made of polystyrene resin and sendust were investigated in the frequency range from 1 to 40 GHz. The size of sendust particles was varied between approximately 5 and 20 μm. A metal-backed single-layer absorber made of 20 μm sendust particles absorbed more than 99% of electromagnetic wave power at frequencies above 20 GHz. Meanwhile, a composite made of 5 μm particles exhibited a return loss of less than -20 dB in the frequency range of not only several GHz but also above 30 GHz. In addition, the relative complex permeability μr * was shown to be controlled by adjusting the particle size of sendust, and an electromagnetic wave absorber with a flexible design was proposed.
KW - Composite electromagnetic wave absorber
KW - Eddy current
KW - Relative complex permeability
KW - Sendust
UR - http://www.scopus.com/inward/record.url?scp=75749091141&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=75749091141&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.421-422.451
DO - 10.4028/www.scientific.net/KEM.421-422.451
M3 - Conference contribution
AN - SCOPUS:75749091141
SN - 0878493069
SN - 9780878493067
T3 - Key Engineering Materials
SP - 451
EP - 454
BT - Asian Ceramic Science for Electronics III and Electroceramics in Japan XII
PB - Trans Tech Publications Ltd
T2 - 6th Asian Meeting on Electroceramics, AMEC-6, in conjunction with the Electronics Division Meeting of the Ceramic Society of Japan
Y2 - 22 October 2008 through 24 October 2008
ER -