Abstract
The purpose of this study was to evaluate if a low-shrinking composite can improve the bonding effectiveness of adhesives in highly constrained conditions. A low-shrinking composite ('els-extra low shrinkage', Saremco) was bonded in standardized occlusal Class-I cavities using a three-step ('cmf', Saremco) and a two-step etch-and-rinse adhesive ('XP Bond', Dentsply). Both adhesives were also combined with a conventional composite ('Z100', 3M ESPE). Half of the restored cavities were exposed to 20,000 thermo-cycles. 3-way ANOVA revealed a significant effect for the factors 'adhesive' and 'composite' (both p<0.0001), but not for 'thermo-cycling' (p=0.994). Significantly higher bond strengths were recorded for the low-shrinking composite than for the control composite, using either of the adhesives. The low-shrinking composite in combination with the three-step etch-and-rinse adhesive performed best in the high C-factor Class-I cavity. The two-step etch-and-rinse adhesive suffered strongly from polymerization-shrinkage stress, which could be partially restored by using the low-shrinking composite.
Original language | English |
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Pages (from-to) | 418-426 |
Number of pages | 9 |
Journal | Dental materials journal |
Volume | 31 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2012 |
Keywords
- Bond strength
- Class-I cavity
- Etch and rinse
- Low-shrinking composite
- Thermo-cycling
ASJC Scopus subject areas
- Ceramics and Composites
- Dentistry(all)