Effect of laser irradiation on generation and growth of whiskers in tin-electroplated film

Yutaka Mitooka, Koji Murakami, Makoto Hino, Masao Takamizawa, Jun Takada

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In order to suppress generation and growth of whiskers, the effect of laser irradiation on tin-electroplated film on copper was studied by scanning electron microscopy and X-ray diffraction method. In the case of as-plated film, whiskers were generated on the electroplated tin film of 1 μm thickness within 432 ks. Residual stress of this film and the number of whiskers increased with the amount of copper-tin intermetallic compounds (Cu 6Sn 5) which developed between the plated film and the copper substrate. On the other hand, in electroplated tin film subjected to diode laser of 300 W for 100 to 1000 ms, no whiskers were formed even after 10 Ms. Residual stress of tin after laser irradiation was tensional at first, then, the stress did not change appreciably after 2.6 Ms. Uniform layer of Cu 6Sn 5 was formed immediately after laser irradiation, and the morphology showed no meaningful change even after 10 Ms. Whiskers are thought to be suppressed by covering the interface between tin and copper with layer of Cu 6Sn 5 and by reducing nonuniformity of stress field.

Original languageEnglish
Pages (from-to)226-233
Number of pages8
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume73
Issue number3
DOIs
Publication statusPublished - Mar 2009

Fingerprint

Tin
Laser beam effects
tin
irradiation
Copper
lasers
copper
residual stress
Residual stresses
Tin Compounds
nonuniformity
stress distribution
Intermetallics
intermetallics
Semiconductor lasers
coverings
semiconductor lasers
X ray diffraction
Scanning electron microscopy
scanning electron microscopy

Keywords

  • Intermetallic compound
  • laser irradiation
  • residual stress
  • Tin plating
  • Whisker

ASJC Scopus subject areas

  • Mechanics of Materials
  • Materials Chemistry
  • Metals and Alloys
  • Condensed Matter Physics

Cite this

Effect of laser irradiation on generation and growth of whiskers in tin-electroplated film. / Mitooka, Yutaka; Murakami, Koji; Hino, Makoto; Takamizawa, Masao; Takada, Jun.

In: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, Vol. 73, No. 3, 03.2009, p. 226-233.

Research output: Contribution to journalArticle

Mitooka, Yutaka ; Murakami, Koji ; Hino, Makoto ; Takamizawa, Masao ; Takada, Jun. / Effect of laser irradiation on generation and growth of whiskers in tin-electroplated film. In: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals. 2009 ; Vol. 73, No. 3. pp. 226-233.
@article{c86608e082244fefb4e1768c37d3d5bf,
title = "Effect of laser irradiation on generation and growth of whiskers in tin-electroplated film",
abstract = "In order to suppress generation and growth of whiskers, the effect of laser irradiation on tin-electroplated film on copper was studied by scanning electron microscopy and X-ray diffraction method. In the case of as-plated film, whiskers were generated on the electroplated tin film of 1 μm thickness within 432 ks. Residual stress of this film and the number of whiskers increased with the amount of copper-tin intermetallic compounds (Cu 6Sn 5) which developed between the plated film and the copper substrate. On the other hand, in electroplated tin film subjected to diode laser of 300 W for 100 to 1000 ms, no whiskers were formed even after 10 Ms. Residual stress of tin after laser irradiation was tensional at first, then, the stress did not change appreciably after 2.6 Ms. Uniform layer of Cu 6Sn 5 was formed immediately after laser irradiation, and the morphology showed no meaningful change even after 10 Ms. Whiskers are thought to be suppressed by covering the interface between tin and copper with layer of Cu 6Sn 5 and by reducing nonuniformity of stress field.",
keywords = "Intermetallic compound, laser irradiation, residual stress, Tin plating, Whisker",
author = "Yutaka Mitooka and Koji Murakami and Makoto Hino and Masao Takamizawa and Jun Takada",
year = "2009",
month = "3",
doi = "10.2320/jinstmet.73.226",
language = "English",
volume = "73",
pages = "226--233",
journal = "Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals",
issn = "0021-4876",
publisher = "Japan Institute of Metals (JIM)",
number = "3",

}

TY - JOUR

T1 - Effect of laser irradiation on generation and growth of whiskers in tin-electroplated film

AU - Mitooka, Yutaka

AU - Murakami, Koji

AU - Hino, Makoto

AU - Takamizawa, Masao

AU - Takada, Jun

PY - 2009/3

Y1 - 2009/3

N2 - In order to suppress generation and growth of whiskers, the effect of laser irradiation on tin-electroplated film on copper was studied by scanning electron microscopy and X-ray diffraction method. In the case of as-plated film, whiskers were generated on the electroplated tin film of 1 μm thickness within 432 ks. Residual stress of this film and the number of whiskers increased with the amount of copper-tin intermetallic compounds (Cu 6Sn 5) which developed between the plated film and the copper substrate. On the other hand, in electroplated tin film subjected to diode laser of 300 W for 100 to 1000 ms, no whiskers were formed even after 10 Ms. Residual stress of tin after laser irradiation was tensional at first, then, the stress did not change appreciably after 2.6 Ms. Uniform layer of Cu 6Sn 5 was formed immediately after laser irradiation, and the morphology showed no meaningful change even after 10 Ms. Whiskers are thought to be suppressed by covering the interface between tin and copper with layer of Cu 6Sn 5 and by reducing nonuniformity of stress field.

AB - In order to suppress generation and growth of whiskers, the effect of laser irradiation on tin-electroplated film on copper was studied by scanning electron microscopy and X-ray diffraction method. In the case of as-plated film, whiskers were generated on the electroplated tin film of 1 μm thickness within 432 ks. Residual stress of this film and the number of whiskers increased with the amount of copper-tin intermetallic compounds (Cu 6Sn 5) which developed between the plated film and the copper substrate. On the other hand, in electroplated tin film subjected to diode laser of 300 W for 100 to 1000 ms, no whiskers were formed even after 10 Ms. Residual stress of tin after laser irradiation was tensional at first, then, the stress did not change appreciably after 2.6 Ms. Uniform layer of Cu 6Sn 5 was formed immediately after laser irradiation, and the morphology showed no meaningful change even after 10 Ms. Whiskers are thought to be suppressed by covering the interface between tin and copper with layer of Cu 6Sn 5 and by reducing nonuniformity of stress field.

KW - Intermetallic compound

KW - laser irradiation

KW - residual stress

KW - Tin plating

KW - Whisker

UR - http://www.scopus.com/inward/record.url?scp=66149091051&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=66149091051&partnerID=8YFLogxK

U2 - 10.2320/jinstmet.73.226

DO - 10.2320/jinstmet.73.226

M3 - Article

AN - SCOPUS:66149091051

VL - 73

SP - 226

EP - 233

JO - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

JF - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

SN - 0021-4876

IS - 3

ER -