Effect of EBG structure and ferrite film on power/ground layers for performance maintenance and noise suppression in wireless communication

Kenta Ishimura, Yoshitaka Toyota, Kengo Iokibe, Koichi Kondo, Shigeyoshi Yoshida

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Noise suppression and power integrity are two requirements for power/ground layers of printed circuit boards. To accomplish the requirements, we proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. To evaluate the proposed EBG structure, we have so far measured the electric characteristics of both driving-point impedance and transmission coefficient. Although these evaluation indices are helpful, the evaluation using an actual device is also indispensable. In this paper, we evaluated the suppression of noise propagation through power bus by the proposed EBG structure in wireless communication module. The proposed structure provided sufficient result of the effective maintenance of communication quality by suppressing the propagation of electromagnetic noise.

Original languageEnglish
Title of host publicationEDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
Pages217-220
Number of pages4
DOIs
Publication statusPublished - 2013
Event2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 - Nara, Japan
Duration: Dec 12 2013Dec 15 2013

Other

Other2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
CountryJapan
CityNara
Period12/12/1312/15/13

Fingerprint

Ferrite
Energy gap
Communication
Printed circuit boards

Keywords

  • actual device
  • electromagnetic bandgap (EBG)
  • ferrite film
  • noise suppression
  • performance maintenance
  • wireless communication

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Ishimura, K., Toyota, Y., Iokibe, K., Kondo, K., & Yoshida, S. (2013). Effect of EBG structure and ferrite film on power/ground layers for performance maintenance and noise suppression in wireless communication. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (pp. 217-220). [6724428] https://doi.org/10.1109/EDAPS.2013.6724428

Effect of EBG structure and ferrite film on power/ground layers for performance maintenance and noise suppression in wireless communication. / Ishimura, Kenta; Toyota, Yoshitaka; Iokibe, Kengo; Kondo, Koichi; Yoshida, Shigeyoshi.

EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 217-220 6724428.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ishimura, K, Toyota, Y, Iokibe, K, Kondo, K & Yoshida, S 2013, Effect of EBG structure and ferrite film on power/ground layers for performance maintenance and noise suppression in wireless communication. in EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium., 6724428, pp. 217-220, 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013, Nara, Japan, 12/12/13. https://doi.org/10.1109/EDAPS.2013.6724428
Ishimura K, Toyota Y, Iokibe K, Kondo K, Yoshida S. Effect of EBG structure and ferrite film on power/ground layers for performance maintenance and noise suppression in wireless communication. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 217-220. 6724428 https://doi.org/10.1109/EDAPS.2013.6724428
Ishimura, Kenta ; Toyota, Yoshitaka ; Iokibe, Kengo ; Kondo, Koichi ; Yoshida, Shigeyoshi. / Effect of EBG structure and ferrite film on power/ground layers for performance maintenance and noise suppression in wireless communication. EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. pp. 217-220
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