Noise suppression and power integrity are two requirements for power/ground layers of printed circuit boards. To accomplish the requirements, we proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. To evaluate the proposed EBG structure, we have so far measured the electric characteristics of both driving-point impedance and transmission coefficient. Although these evaluation indices are helpful, the evaluation using an actual device is also indispensable. In this paper, we evaluated the suppression of noise propagation through power bus by the proposed EBG structure in wireless communication module. The proposed structure provided sufficient result of the effective maintenance of communication quality by suppressing the propagation of electromagnetic noise.