Effect of Bi doping on the modulated composite structure of (Sr2Cu2O3)0.70CuO2, "Sr14Cu24O41"

Y. Gotoh, I. Yamaguchi, J. Akimoto, Y. Takahashi, Jun Akimitsu

Research output: Contribution to journalArticle

Abstract

The effect of Bi doping on the modulated composite structure of (Sr2Cu2O3)0.70CuO2 has been extensively investigated on the basis of (3+1)-dimensional superspace group approach. By applying the bond-valence-sum method for the modulated composite structure, it has become apparent that the valence state of the Cu atom in any sites of the Cu2O3 ladder in (Sr2-xBixCu2O3)0.70CuO 2 is maintained divalent. The interatomic distance between the Cu atom in the two-legged Cu2O3 ladder and the O atom in the CuO2 chain becomes larger with Bi doping, in spite of the slight shrinkage of lattice dimension along the stacking direction. The hole transfer from the CuO2 chain to the Cu2O3 ladder in (Sr2Cu2O3)0.70CuO2 is depressed by the effect of Bi doping on the atomic modulations.

Original languageEnglish
Pages (from-to)131-136
Number of pages6
JournalPhysica C: Superconductivity and its Applications
Volume378-381
Issue numberPART 1
DOIs
Publication statusPublished - Oct 1 2002
Externally publishedYes

Fingerprint

Ladders
composite structures
Composite structures
ladders
Doping (additives)
Atoms
valence
atoms
shrinkage
Modulation
modulation

Keywords

  • Composite crystal
  • Ladder cuprate
  • Modulated structure
  • SrCuO

ASJC Scopus subject areas

  • Condensed Matter Physics

Cite this

Effect of Bi doping on the modulated composite structure of (Sr2Cu2O3)0.70CuO2, "Sr14Cu24O41". / Gotoh, Y.; Yamaguchi, I.; Akimoto, J.; Takahashi, Y.; Akimitsu, Jun.

In: Physica C: Superconductivity and its Applications, Vol. 378-381, No. PART 1, 01.10.2002, p. 131-136.

Research output: Contribution to journalArticle

Gotoh, Y. ; Yamaguchi, I. ; Akimoto, J. ; Takahashi, Y. ; Akimitsu, Jun. / Effect of Bi doping on the modulated composite structure of (Sr2Cu2O3)0.70CuO2, "Sr14Cu24O41". In: Physica C: Superconductivity and its Applications. 2002 ; Vol. 378-381, No. PART 1. pp. 131-136.
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