Development of multi-wire EDM slicing method for silicon ingot

Yasuhiro Okamoto, Yoshiyuki Uno, Akira Okada, Satoru Ohshita, Tameyoshi Hirano, Shiro Takata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 23rd Annual Meeting of the American Society for Precision Engineering, ASPE 2008 and the 12th ICPE
Publication statusPublished - Dec 1 2008
Event23rd Annual Meeting of the American Society for Precision Engineering, ASPE 2008 and the 12th ICPE - Portland, OR, United States
Duration: Oct 19 2008Oct 24 2008

Publication series

NameProceedings of the 23rd Annual Meeting of the American Society for Precision Engineering, ASPE 2008 and the 12th ICPE

Other

Other23rd Annual Meeting of the American Society for Precision Engineering, ASPE 2008 and the 12th ICPE
CountryUnited States
CityPortland, OR
Period10/19/0810/24/08

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Okamoto, Y., Uno, Y., Okada, A., Ohshita, S., Hirano, T., & Takata, S. (2008). Development of multi-wire EDM slicing method for silicon ingot. In Proceedings of the 23rd Annual Meeting of the American Society for Precision Engineering, ASPE 2008 and the 12th ICPE (Proceedings of the 23rd Annual Meeting of the American Society for Precision Engineering, ASPE 2008 and the 12th ICPE).