Development of intelligent cylindrical grinding system considering thermal deformation of workpiece

Takashi Onishi, Moriaki Sakakura, Takuo Okanoue, Yasuhiro Fujiyama, Kazuhito Ohashi

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

In cylindrical grinding, thermal deformation of a ground workpiece can reduce the size accuracy. To improve the size accuracy, it is necessary to consider the thermal deformation during grinding process. In this study, we develop an intelligent grinding system that can consider the thermal deformation of the ground workpiece. In this system the thermal deformation of the workpiece is simulated during grinding process. The thermal deformation is simulated from the measured grinding force. Grinding force is measured by the strain gauges mounted on the race center. The grinding heat conducted into the ground workpiece is estimated from the measured normal grinding force. The net stock removal, that is the stock removal measured after the workpiece is cooled, is estimated by adding the measured stock removal and simulated thermal deformation of the workpiece. To obtain the target stock removal, the grinding wheel is retracted as the net stock removal is reached to the target stock removal. With using the developed grinding system, grinding experiments were carried out. In these grinding experiments, the size error is reduced less than 1 micro meter in radius even though the thermal deformation is more than 2 micro meters in radius. With grinding experiments, it is confirmed that the developed grinding system can improve the size accuracy successfully.

Original languageEnglish
DOIs
Publication statusPublished - Nov 13 2017
Event9th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2017 - Hiroshima City, Japan
Duration: Nov 13 2017Nov 17 2017

Other

Other9th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2017
CountryJapan
CityHiroshima City
Period11/13/1711/17/17

Keywords

  • Cylindrical grinding
  • Grinding heat
  • Intelligent grinding system
  • Size accuracy
  • Thermal deformation

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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  • Cite this

    Onishi, T., Sakakura, M., Okanoue, T., Fujiyama, Y., & Ohashi, K. (2017). Development of intelligent cylindrical grinding system considering thermal deformation of workpiece. Paper presented at 9th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2017, Hiroshima City, Japan. https://doi.org/10.1299/jsmelem.2017.9.143