Abstract
In cylindrical grinding, thermal deformation of a ground workpiece can reduce the size accuracy. To improve the size accuracy, it is necessary to consider the thermal deformation during grinding process. In this study, we develop an intelligent grinding system that can consider the thermal deformation of the ground workpiece. In this system the thermal deformation of the workpiece is simulated during grinding process. The thermal deformation is simulated from the measured grinding force. Grinding force is measured by the strain gauges mounted on the race center. The grinding heat conducted into the ground workpiece is estimated from the measured normal grinding force. The net stock removal, that is the stock removal measured after the workpiece is cooled, is estimated by adding the measured stock removal and simulated thermal deformation of the workpiece. To obtain the target stock removal, the grinding wheel is retracted as the net stock removal is reached to the target stock removal. With using the developed grinding system, grinding experiments were carried out. In these grinding experiments, the size error is reduced less than 1 micro meter in radius even though the thermal deformation is more than 2 micro meters in radius. With grinding experiments, it is confirmed that the developed grinding system can improve the size accuracy successfully.
| Original language | English |
|---|---|
| Publication status | Published - Nov 13 2017 |
| Event | 9th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2017 - Hiroshima City, Japan Duration: Nov 13 2017 → Nov 17 2017 |
Other
| Other | 9th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2017 |
|---|---|
| Country | Japan |
| City | Hiroshima City |
| Period | 11/13/17 → 11/17/17 |
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Keywords
- Cylindrical grinding
- Grinding heat
- Intelligent grinding system
- Size accuracy
- Thermal deformation
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
Cite this
Development of intelligent cylindrical grinding system considering thermal deformation of workpiece. / Onishi, Takashi; Sakakura, Moriaki; Okanoue, Takuo; Fujiyama, Yasuhiro; Oohashi, Kazuhito.
2017. Paper presented at 9th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2017, Hiroshima City, Japan.Research output: Contribution to conference › Paper
}
TY - CONF
T1 - Development of intelligent cylindrical grinding system considering thermal deformation of workpiece
AU - Onishi, Takashi
AU - Sakakura, Moriaki
AU - Okanoue, Takuo
AU - Fujiyama, Yasuhiro
AU - Oohashi, Kazuhito
PY - 2017/11/13
Y1 - 2017/11/13
N2 - In cylindrical grinding, thermal deformation of a ground workpiece can reduce the size accuracy. To improve the size accuracy, it is necessary to consider the thermal deformation during grinding process. In this study, we develop an intelligent grinding system that can consider the thermal deformation of the ground workpiece. In this system the thermal deformation of the workpiece is simulated during grinding process. The thermal deformation is simulated from the measured grinding force. Grinding force is measured by the strain gauges mounted on the race center. The grinding heat conducted into the ground workpiece is estimated from the measured normal grinding force. The net stock removal, that is the stock removal measured after the workpiece is cooled, is estimated by adding the measured stock removal and simulated thermal deformation of the workpiece. To obtain the target stock removal, the grinding wheel is retracted as the net stock removal is reached to the target stock removal. With using the developed grinding system, grinding experiments were carried out. In these grinding experiments, the size error is reduced less than 1 micro meter in radius even though the thermal deformation is more than 2 micro meters in radius. With grinding experiments, it is confirmed that the developed grinding system can improve the size accuracy successfully.
AB - In cylindrical grinding, thermal deformation of a ground workpiece can reduce the size accuracy. To improve the size accuracy, it is necessary to consider the thermal deformation during grinding process. In this study, we develop an intelligent grinding system that can consider the thermal deformation of the ground workpiece. In this system the thermal deformation of the workpiece is simulated during grinding process. The thermal deformation is simulated from the measured grinding force. Grinding force is measured by the strain gauges mounted on the race center. The grinding heat conducted into the ground workpiece is estimated from the measured normal grinding force. The net stock removal, that is the stock removal measured after the workpiece is cooled, is estimated by adding the measured stock removal and simulated thermal deformation of the workpiece. To obtain the target stock removal, the grinding wheel is retracted as the net stock removal is reached to the target stock removal. With using the developed grinding system, grinding experiments were carried out. In these grinding experiments, the size error is reduced less than 1 micro meter in radius even though the thermal deformation is more than 2 micro meters in radius. With grinding experiments, it is confirmed that the developed grinding system can improve the size accuracy successfully.
KW - Cylindrical grinding
KW - Grinding heat
KW - Intelligent grinding system
KW - Size accuracy
KW - Thermal deformation
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M3 - Paper
AN - SCOPUS:85041320982
ER -