Development of image analysis for detection of defects of BGA by using X-ray images

Tetsuhiro Sumimoto, Toshinori Maruyama, Yoshiharu Azuma, Sachiko Goto, Munehiro Mondou, Noboru Furukawa, Saburo Okada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

In the surface mount technology, Ball Grid Array (BGA) has been used in a production of PC boards, because of their excellent characters such as high density of the lead pin pitch, better lead rigidity and self-alignment during re-flow processing. This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray images. In the conventional IC boards, it is possible to detect defects of solder joints by visual inspection, because the lead of IC package is set on its outside. However, we can't detect visually defects at BGA solder joints, because they are hidden under the IC package. In a production line, the inspection of BGA in PC boards depends on the function test of electric circuits in the final process. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristics of the solder bridges based on an image analysis.

Original languageEnglish
Title of host publicationConference Record - IEEE Instrumentation and Measurement Technology Conference
Pages1131-1136
Number of pages6
Volume2
Publication statusPublished - 2003
EventProceedings of the 20th IEEE Information and Measurement Technology Conference - Vail, CO, United States
Duration: May 20 2003May 22 2003

Other

OtherProceedings of the 20th IEEE Information and Measurement Technology Conference
CountryUnited States
CityVail, CO
Period5/20/035/22/03

Fingerprint

Ball grid arrays
solders
image analysis
Soldering alloys
Image analysis
balls
grids
X rays
Defects
defects
x rays
inspection
Inspection
Lead
self alignment
Surface mount technology
rigidity
Rigidity
image processing
voids

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

Sumimoto, T., Maruyama, T., Azuma, Y., Goto, S., Mondou, M., Furukawa, N., & Okada, S. (2003). Development of image analysis for detection of defects of BGA by using X-ray images. In Conference Record - IEEE Instrumentation and Measurement Technology Conference (Vol. 2, pp. 1131-1136)

Development of image analysis for detection of defects of BGA by using X-ray images. / Sumimoto, Tetsuhiro; Maruyama, Toshinori; Azuma, Yoshiharu; Goto, Sachiko; Mondou, Munehiro; Furukawa, Noboru; Okada, Saburo.

Conference Record - IEEE Instrumentation and Measurement Technology Conference. Vol. 2 2003. p. 1131-1136.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sumimoto, T, Maruyama, T, Azuma, Y, Goto, S, Mondou, M, Furukawa, N & Okada, S 2003, Development of image analysis for detection of defects of BGA by using X-ray images. in Conference Record - IEEE Instrumentation and Measurement Technology Conference. vol. 2, pp. 1131-1136, Proceedings of the 20th IEEE Information and Measurement Technology Conference, Vail, CO, United States, 5/20/03.
Sumimoto T, Maruyama T, Azuma Y, Goto S, Mondou M, Furukawa N et al. Development of image analysis for detection of defects of BGA by using X-ray images. In Conference Record - IEEE Instrumentation and Measurement Technology Conference. Vol. 2. 2003. p. 1131-1136
Sumimoto, Tetsuhiro ; Maruyama, Toshinori ; Azuma, Yoshiharu ; Goto, Sachiko ; Mondou, Munehiro ; Furukawa, Noboru ; Okada, Saburo. / Development of image analysis for detection of defects of BGA by using X-ray images. Conference Record - IEEE Instrumentation and Measurement Technology Conference. Vol. 2 2003. pp. 1131-1136
@inproceedings{73ee47f449ef4b5c9b5693fbcb4f7337,
title = "Development of image analysis for detection of defects of BGA by using X-ray images",
abstract = "In the surface mount technology, Ball Grid Array (BGA) has been used in a production of PC boards, because of their excellent characters such as high density of the lead pin pitch, better lead rigidity and self-alignment during re-flow processing. This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray images. In the conventional IC boards, it is possible to detect defects of solder joints by visual inspection, because the lead of IC package is set on its outside. However, we can't detect visually defects at BGA solder joints, because they are hidden under the IC package. In a production line, the inspection of BGA in PC boards depends on the function test of electric circuits in the final process. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristics of the solder bridges based on an image analysis.",
author = "Tetsuhiro Sumimoto and Toshinori Maruyama and Yoshiharu Azuma and Sachiko Goto and Munehiro Mondou and Noboru Furukawa and Saburo Okada",
year = "2003",
language = "English",
volume = "2",
pages = "1131--1136",
booktitle = "Conference Record - IEEE Instrumentation and Measurement Technology Conference",

}

TY - GEN

T1 - Development of image analysis for detection of defects of BGA by using X-ray images

AU - Sumimoto, Tetsuhiro

AU - Maruyama, Toshinori

AU - Azuma, Yoshiharu

AU - Goto, Sachiko

AU - Mondou, Munehiro

AU - Furukawa, Noboru

AU - Okada, Saburo

PY - 2003

Y1 - 2003

N2 - In the surface mount technology, Ball Grid Array (BGA) has been used in a production of PC boards, because of their excellent characters such as high density of the lead pin pitch, better lead rigidity and self-alignment during re-flow processing. This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray images. In the conventional IC boards, it is possible to detect defects of solder joints by visual inspection, because the lead of IC package is set on its outside. However, we can't detect visually defects at BGA solder joints, because they are hidden under the IC package. In a production line, the inspection of BGA in PC boards depends on the function test of electric circuits in the final process. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristics of the solder bridges based on an image analysis.

AB - In the surface mount technology, Ball Grid Array (BGA) has been used in a production of PC boards, because of their excellent characters such as high density of the lead pin pitch, better lead rigidity and self-alignment during re-flow processing. This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray images. In the conventional IC boards, it is possible to detect defects of solder joints by visual inspection, because the lead of IC package is set on its outside. However, we can't detect visually defects at BGA solder joints, because they are hidden under the IC package. In a production line, the inspection of BGA in PC boards depends on the function test of electric circuits in the final process. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to detect the characteristics of the solder bridges based on an image analysis.

UR - http://www.scopus.com/inward/record.url?scp=0037484144&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0037484144&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0037484144

VL - 2

SP - 1131

EP - 1136

BT - Conference Record - IEEE Instrumentation and Measurement Technology Conference

ER -