Design methodology of tightly coupled asymmetrically tapered bend for high-density mounting in differential transmission lines

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The bend in a pair of differential transmission lines on printed circuit boards causes a path difference, which leads to mode conversion due to the phase difference. We previously proposed a tightly coupled asymmetrically tapered bend to suppress forward differential-to-common mode conversion. In this paper, we propose a design methodology of our tightly coupled asymmetrically tapered bend that limits the bend structure within the area of the original classic bend for high-density mounting. We also evaluated the 45-degree-angle bend formed based on our design methodology and found that the methodology helps improve or maintain its transmission characteristics compared to those of the classic bend.

Original languageEnglish
Title of host publication2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages463-465
Number of pages3
ISBN (Electronic)9781467394949
DOIs
Publication statusPublished - Jul 26 2016
Event7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016 - Shenzhen, China
Duration: May 17 2016May 21 2016

Other

Other7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016
CountryChina
CityShenzhen
Period5/17/165/21/16

Keywords

  • asymmetric tapers
  • bend
  • design methodology
  • differential transmission lines
  • high-density mounting
  • mode conversion

ASJC Scopus subject areas

  • Radiation
  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Instrumentation

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  • Cite this

    Wang, C., Iokibe, K., & Toyota, Y. (2016). Design methodology of tightly coupled asymmetrically tapered bend for high-density mounting in differential transmission lines. In 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016 (pp. 463-465). [7522769] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEMC.2016.7522769