Cracking and delamination behavior of gold thin strip deposited on polycarbonate plate under cyclic and stepwisely-increased trapezoidal tension

Ya Fei Hu, Nao Ya Tada, Ichiro Shimizu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Cracking and delamination behavior of small rounded-rectangular gold thin films called "strips" with a thickness less than one micrometer was observed under cyclic and stepwisely-increased trapezoidal tensions. Three strips in different directions were deposited on a polycarbonate plate specimen which was subjected to tensile loading. Straight slit and Vickers indentation were introduced as initial defects on each strip and cracking and delamination which were initiated around the defects were observed. In strips with slit, delamination was observed when introducing the slit. It was suggested that the delamination was caused by the residual stress accumulated during deposition. The growth of delamination was also observed during cyclic tension. In strips with indentation, complex cracking and delamination behavior was observed depending on the strip direction, which seemed to be attributed to the interactive effect of residual stress by deposition and external mechanical loading.

Original languageEnglish
Title of host publicationRecent Engineering Decisions in Industry
PublisherTrans Tech Publications Ltd
Pages36-44
Number of pages9
ISBN (Print)9783038351689
DOIs
Publication statusPublished - 2014
Event2nd International Conference on Materials Science and Mechanical Engineering, ICMSME 2014 - Taipei, Taiwan, Province of China
Duration: May 31 2014Jun 1 2014

Publication series

NameApplied Mechanics and Materials
Volume595
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Other

Other2nd International Conference on Materials Science and Mechanical Engineering, ICMSME 2014
CountryTaiwan, Province of China
CityTaipei
Period5/31/146/1/14

Keywords

  • Cracking
  • Delamination
  • Gold thin strip
  • Polycarbonate
  • Tension

ASJC Scopus subject areas

  • Engineering(all)

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