Abstract
Multi-wire EDM slicing method have been developed to overcome problems of conventional multi-wire saw method, and high-efficient and high-accurate slicing could be expected compared with a single-wire EDM technologies. Recently, a group power supplying method was newly proposed to satisfy both processing efficiency and simplification of slicing equipment, and it can supply sufficient discharge energy to multiple processing wire electrodes only using one conductivity piece set with one EDM power unit. Input energies were almost constant at each processing wire electrode, and electrical discharge pulses could be homogeneously distributed to each processing point without the wire breakage even by using only one conductivity piece set in the group power supplying method. This multi-wire EDM slicing method with the group power supplying can slice materials into many wafers of a certain thickness according to the pitch distance of processing wire electrode. In this method, it is important to perform the uniform kerf width in order to achieve a constant thickness of wafer. However, the cutting width of workpiece always varies in the case of silicon and silicon carbide ingots with circular cross section. Therefore, influence of cutting width of workpiece on slicing characteristics was experimentally investigated to achieve the uniform kerf width. The maximum feed rate of workpiece had a great influence on the kerf width with different cutting width of workpiece, and a larger kerf width was obtained with decreasing the cutting width of workpiece under a constant maximum feed rate condition. A uniform kerf width could be obtained by setting a half and quarter maximum feed rate of workpiece, although the cutting width of workpiece increased by twice or four times.
| Original language | English |
|---|---|
| Pages (from-to) | 100-103 |
| Number of pages | 4 |
| Journal | Procedia CIRP |
| Volume | 68 |
| DOIs | |
| Publication status | Published - Jan 1 2018 |
| Event | 19th CIRP Conference on Electro Physical and Electro Chemical Machining 2018 - Bilbao, Spain Duration: Apr 23 2017 → Apr 27 2017 |
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ASJC Scopus subject areas
- Control and Systems Engineering
- Industrial and Manufacturing Engineering
Cite this
Control of Kerf Width in Multi-wire EDM Slicing of Semiconductors with Circular Section. / Okamoto, Yasuhiro; Ikeda, Takayuki; Kurihara, Haruya; Okada, Akira; Kido, Masataka.
In: Procedia CIRP, Vol. 68, 01.01.2018, p. 100-103.Research output: Contribution to journal › Conference article
}
TY - JOUR
T1 - Control of Kerf Width in Multi-wire EDM Slicing of Semiconductors with Circular Section
AU - Okamoto, Yasuhiro
AU - Ikeda, Takayuki
AU - Kurihara, Haruya
AU - Okada, Akira
AU - Kido, Masataka
PY - 2018/1/1
Y1 - 2018/1/1
N2 - Multi-wire EDM slicing method have been developed to overcome problems of conventional multi-wire saw method, and high-efficient and high-accurate slicing could be expected compared with a single-wire EDM technologies. Recently, a group power supplying method was newly proposed to satisfy both processing efficiency and simplification of slicing equipment, and it can supply sufficient discharge energy to multiple processing wire electrodes only using one conductivity piece set with one EDM power unit. Input energies were almost constant at each processing wire electrode, and electrical discharge pulses could be homogeneously distributed to each processing point without the wire breakage even by using only one conductivity piece set in the group power supplying method. This multi-wire EDM slicing method with the group power supplying can slice materials into many wafers of a certain thickness according to the pitch distance of processing wire electrode. In this method, it is important to perform the uniform kerf width in order to achieve a constant thickness of wafer. However, the cutting width of workpiece always varies in the case of silicon and silicon carbide ingots with circular cross section. Therefore, influence of cutting width of workpiece on slicing characteristics was experimentally investigated to achieve the uniform kerf width. The maximum feed rate of workpiece had a great influence on the kerf width with different cutting width of workpiece, and a larger kerf width was obtained with decreasing the cutting width of workpiece under a constant maximum feed rate condition. A uniform kerf width could be obtained by setting a half and quarter maximum feed rate of workpiece, although the cutting width of workpiece increased by twice or four times.
AB - Multi-wire EDM slicing method have been developed to overcome problems of conventional multi-wire saw method, and high-efficient and high-accurate slicing could be expected compared with a single-wire EDM technologies. Recently, a group power supplying method was newly proposed to satisfy both processing efficiency and simplification of slicing equipment, and it can supply sufficient discharge energy to multiple processing wire electrodes only using one conductivity piece set with one EDM power unit. Input energies were almost constant at each processing wire electrode, and electrical discharge pulses could be homogeneously distributed to each processing point without the wire breakage even by using only one conductivity piece set in the group power supplying method. This multi-wire EDM slicing method with the group power supplying can slice materials into many wafers of a certain thickness according to the pitch distance of processing wire electrode. In this method, it is important to perform the uniform kerf width in order to achieve a constant thickness of wafer. However, the cutting width of workpiece always varies in the case of silicon and silicon carbide ingots with circular cross section. Therefore, influence of cutting width of workpiece on slicing characteristics was experimentally investigated to achieve the uniform kerf width. The maximum feed rate of workpiece had a great influence on the kerf width with different cutting width of workpiece, and a larger kerf width was obtained with decreasing the cutting width of workpiece under a constant maximum feed rate condition. A uniform kerf width could be obtained by setting a half and quarter maximum feed rate of workpiece, although the cutting width of workpiece increased by twice or four times.
UR - http://www.scopus.com/inward/record.url?scp=85049245420&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85049245420&partnerID=8YFLogxK
U2 - 10.1016/j.procir.2017.12.030
DO - 10.1016/j.procir.2017.12.030
M3 - Conference article
AN - SCOPUS:85049245420
VL - 68
SP - 100
EP - 103
JO - Procedia CIRP
JF - Procedia CIRP
SN - 2212-8271
ER -