Composite electromagnetic wave absorber made of both sendust and aluminum particles dispersed in polystyrene resin

Kenji Sakai, Yang Guan, Yuuki Sato, Shinzo Yoshikado

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To design an electromagnetic wave absorber with good absorption properties at frequencies above 1 GHz, the frequency dependences of the relative complex permeability μr*, the relative complex permittivity εr*, and return loss were investigated for the composite made of both sendust (an alloy of Al 5%, Si 10%, and Fe 85%) and aluminum particles dispersed in polystyrene resin. It was found that the frequency dependence of μr* for this composite can be changed by adjusting the particle size of aluminum and the volume mixture ratio of sendust and aluminum. Therefore, a flexible design of an absorber with good absorption characteristics was proposed based on the ability to control μr*. The composite made of both sendust and aluminum was found to exhibit a return loss of less than -20 dB in the frequency range of not only several GHz but also around 20 GHz if appropriate volume mixture ratio and particle size were selected.

Original languageEnglish
Title of host publicationElectroceramics in Japan XIII
PublisherTrans Tech Publications Ltd
Pages197-200
Number of pages4
ISBN (Print)9780878492640
DOIs
Publication statusPublished - Jan 1 2010
Externally publishedYes

Publication series

NameKey Engineering Materials
Volume445
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Keywords

  • Aluminum
  • Composite
  • Eddy current
  • Electromagnetic wave absorber
  • Relative complex permeability
  • Sendust

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Sakai, K., Guan, Y., Sato, Y., & Yoshikado, S. (2010). Composite electromagnetic wave absorber made of both sendust and aluminum particles dispersed in polystyrene resin. In Electroceramics in Japan XIII (pp. 197-200). (Key Engineering Materials; Vol. 445). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.445.197