Codeposition of titanium dioxide particles from acid copper and zinc sulfate baths

Hidetaka Hayashi, Takahiro Matsunaga, Isao Tari

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The purpose of this work is to elucidate the dependence of the codeposition of titanium dioxide particles on the kind and the amount of adsorbed metal ion. An acid copper sulfate bath with titanium dioxide particles was mainly used for this investigation. The surface OH group of the titanium dioxide particle interacts with Cu2+ in the bath, which results in H+ release. This reaction depends both on the concentration of Cu2+ and on the pH of the solution. It was found that the amount of codeposited titanium dioxide increased with increasing pH of the bath, which indicates that the amount of codepositing particles depends upon the amount of Cu2+ adsorbed on the particle. Relation between the codeposition behavior and the nature of depositing metal ion is also discussed.

Original languageEnglish
Pages (from-to)844-850
Number of pages7
JournalElectrochemistry
Volume66
Issue number8
Publication statusPublished - 1998

Fingerprint

Copper Sulfate
Zinc Sulfate
Titanium dioxide
Zinc
Copper
Acids
Metal ions
titanium dioxide
Sulfates

Keywords

  • Composite plating
  • Copper
  • Potentiometric titration
  • Titania

ASJC Scopus subject areas

  • Electrochemistry

Cite this

Hayashi, H., Matsunaga, T., & Tari, I. (1998). Codeposition of titanium dioxide particles from acid copper and zinc sulfate baths. Electrochemistry, 66(8), 844-850.

Codeposition of titanium dioxide particles from acid copper and zinc sulfate baths. / Hayashi, Hidetaka; Matsunaga, Takahiro; Tari, Isao.

In: Electrochemistry, Vol. 66, No. 8, 1998, p. 844-850.

Research output: Contribution to journalArticle

Hayashi, H, Matsunaga, T & Tari, I 1998, 'Codeposition of titanium dioxide particles from acid copper and zinc sulfate baths', Electrochemistry, vol. 66, no. 8, pp. 844-850.
Hayashi, Hidetaka ; Matsunaga, Takahiro ; Tari, Isao. / Codeposition of titanium dioxide particles from acid copper and zinc sulfate baths. In: Electrochemistry. 1998 ; Vol. 66, No. 8. pp. 844-850.
@article{d1d8fc3503c040d19f403092b9487493,
title = "Codeposition of titanium dioxide particles from acid copper and zinc sulfate baths",
abstract = "The purpose of this work is to elucidate the dependence of the codeposition of titanium dioxide particles on the kind and the amount of adsorbed metal ion. An acid copper sulfate bath with titanium dioxide particles was mainly used for this investigation. The surface OH group of the titanium dioxide particle interacts with Cu2+ in the bath, which results in H+ release. This reaction depends both on the concentration of Cu2+ and on the pH of the solution. It was found that the amount of codeposited titanium dioxide increased with increasing pH of the bath, which indicates that the amount of codepositing particles depends upon the amount of Cu2+ adsorbed on the particle. Relation between the codeposition behavior and the nature of depositing metal ion is also discussed.",
keywords = "Composite plating, Copper, Potentiometric titration, Titania",
author = "Hidetaka Hayashi and Takahiro Matsunaga and Isao Tari",
year = "1998",
language = "English",
volume = "66",
pages = "844--850",
journal = "Electrochemistry",
issn = "1344-3542",
publisher = "Electrochemical Society of Japan",
number = "8",

}

TY - JOUR

T1 - Codeposition of titanium dioxide particles from acid copper and zinc sulfate baths

AU - Hayashi, Hidetaka

AU - Matsunaga, Takahiro

AU - Tari, Isao

PY - 1998

Y1 - 1998

N2 - The purpose of this work is to elucidate the dependence of the codeposition of titanium dioxide particles on the kind and the amount of adsorbed metal ion. An acid copper sulfate bath with titanium dioxide particles was mainly used for this investigation. The surface OH group of the titanium dioxide particle interacts with Cu2+ in the bath, which results in H+ release. This reaction depends both on the concentration of Cu2+ and on the pH of the solution. It was found that the amount of codeposited titanium dioxide increased with increasing pH of the bath, which indicates that the amount of codepositing particles depends upon the amount of Cu2+ adsorbed on the particle. Relation between the codeposition behavior and the nature of depositing metal ion is also discussed.

AB - The purpose of this work is to elucidate the dependence of the codeposition of titanium dioxide particles on the kind and the amount of adsorbed metal ion. An acid copper sulfate bath with titanium dioxide particles was mainly used for this investigation. The surface OH group of the titanium dioxide particle interacts with Cu2+ in the bath, which results in H+ release. This reaction depends both on the concentration of Cu2+ and on the pH of the solution. It was found that the amount of codeposited titanium dioxide increased with increasing pH of the bath, which indicates that the amount of codepositing particles depends upon the amount of Cu2+ adsorbed on the particle. Relation between the codeposition behavior and the nature of depositing metal ion is also discussed.

KW - Composite plating

KW - Copper

KW - Potentiometric titration

KW - Titania

UR - http://www.scopus.com/inward/record.url?scp=0347987421&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0347987421&partnerID=8YFLogxK

M3 - Article

VL - 66

SP - 844

EP - 850

JO - Electrochemistry

JF - Electrochemistry

SN - 1344-3542

IS - 8

ER -