TY - GEN
T1 - Association Metrics between Two Continuous Variables for Software Project Data
AU - Kanehira, Takumi
AU - Monden, Akito
AU - Yucel, Zeynep
N1 - Funding Information:
Part of this research was supported by JSPS KAKENHI Grant number 20K11749.
Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - The correlation coefficient is commonly used in analyses of software project data sets for the purpose of quantifying the relationship between two variables. However, while there are various types of relationships between two variables, the correlation coefficient cannot distinguish between these types. This study proposes new metrics between two continuous variables that have the potential to characterize the relationship types.
AB - The correlation coefficient is commonly used in analyses of software project data sets for the purpose of quantifying the relationship between two variables. However, while there are various types of relationships between two variables, the correlation coefficient cannot distinguish between these types. This study proposes new metrics between two continuous variables that have the potential to characterize the relationship types.
KW - correlation coefficient
KW - soft-ware project data analysis
KW - Software metrics
UR - http://www.scopus.com/inward/record.url?scp=85125699958&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85125699958&partnerID=8YFLogxK
U2 - 10.1109/SNPD51163.2021.9704983
DO - 10.1109/SNPD51163.2021.9704983
M3 - Conference contribution
AN - SCOPUS:85125699958
T3 - Proceedings - 22nd IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2021-Fall
SP - 242
EP - 247
BT - Proceedings - 22nd IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2021-Fall
A2 - Yau, Her-Terng
A2 - Stenzel, Roland
A2 - Shyu, Mei-Ling
A2 - Lin, Hsiung-Cheng
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing, SNPD 2021-Fall
Y2 - 24 November 2021 through 26 November 2021
ER -