Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs

Zhi Liang Wang; Osami Wada; Yoshitaka Toyota; Ryuji Koga

doi:10.1109/ELMAGC.2002.1177545

Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs

Zhi Liang Wang, Osami Wada, Yoshitaka Toyota, Ryuji Koga

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

12 Citations (Scopus)

Abstract

The fast algorithm developed for calculating the resonant characteristics of the power/ground planes in multilayer PCBs, is extented to the case of that the pattern of the power/ground planes consists of several "segments" of rectangles, using the so-called segmentation method. Good agreements between the calculated and measured results have demonstrated the usefulness and accuracy of our fast algorithm and the segmantation method.

Original language	English
Title of host publication	2002 3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002
Editors	Yinghong Wen, Linchang Zhang
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	775-778
Number of pages	4
ISBN (Electronic)	0780372778
DOIs	https://doi.org/10.1109/ELMAGC.2002.1177545
Publication status	Published - 2002
Event	3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002 - Beijing, China Duration: May 21 2002 → May 24 2002

Publication series

Name	IEEE International Symposium on Electromagnetic Compatibility
Volume	2002-January
ISSN (Print)	1077-4076
ISSN (Electronic)	2158-1118

Other

Other	3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002
Country	China
City	Beijing
Period	5/21/02 → 5/24/02

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/ELMAGC.2002.1177545

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Cite this

Wang, Z. L., Wada, O., Toyota, Y., & Koga, R. (2002). Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs. In Y. Wen, & L. Zhang (Eds.), 2002 3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002 (pp. 775-778). [1177545] (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2002-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ELMAGC.2002.1177545

Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs. / Wang, Zhi Liang; Wada, Osami; Toyota, Yoshitaka; Koga, Ryuji.

2002 3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002. ed. / Yinghong Wen; Linchang Zhang. Institute of Electrical and Electronics Engineers Inc., 2002. p. 775-778 1177545 (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2002-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wang, ZL, Wada, O, Toyota, Y & Koga, R 2002, Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs. in Y Wen & L Zhang (eds), 2002 3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002., 1177545, IEEE International Symposium on Electromagnetic Compatibility, vol. 2002-January, Institute of Electrical and Electronics Engineers Inc., pp. 775-778, 3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002, Beijing, China, 5/21/02. https://doi.org/10.1109/ELMAGC.2002.1177545

Wang ZL, Wada O, Toyota Y, Koga R. Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs. In Wen Y, Zhang L, editors, 2002 3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 775-778. 1177545. (IEEE International Symposium on Electromagnetic Compatibility). https://doi.org/10.1109/ELMAGC.2002.1177545

Wang, Zhi Liang ; Wada, Osami ; Toyota, Yoshitaka ; Koga, Ryuji. / Application of segmentation method to analysis of power/ground plane resonance in multilayer PCBs. 2002 3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002. editor / Yinghong Wen ; Linchang Zhang. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 775-778 (IEEE International Symposium on Electromagnetic Compatibility).

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