Analysis of the intergranular cracking process inside polycrystalline heat-resistant materials under creep-fatigue conditions

Naoya Tada, Weisheng Zhou, Takayuki Kitamura, Ryuichi Ohtani

Research output: Chapter in Book/Report/Conference proceedingChapter

3 Citations (Scopus)

Abstract

In order to investigate the intergranular failure process in polycrystalline materials under creep-dominant fatigue, numerical simulation of inner small cracks was conducted on the basis of a simple probabilistic model. Although the simulation condition is determined from experimental observation of the cross section of specimens interrupted at different fatigue cycles, the simulation is carried out continuously and reproduces inner cracking behavior throughout the fatigue life. This enables us not only to extract the spatial distribution of inner cracks at arbitrary creep-fatigue cycles, but also to calculate the propagation rate of each inner crack.

Original languageEnglish
Title of host publicationASTM Special Technical Publication
PublisherAmerican Society for Testing and Materials
Pages87-101
Number of pages15
Volume1297
Publication statusPublished - 1997
Externally publishedYes

Fingerprint

Creep
Fatigue of materials
Cracks
Polycrystalline materials
Spatial distribution
Hot Temperature
Computer simulation

Keywords

  • Creep-fatigue
  • Inner cracking
  • Numerical simulation
  • Probabilistic model

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Tada, N., Zhou, W., Kitamura, T., & Ohtani, R. (1997). Analysis of the intergranular cracking process inside polycrystalline heat-resistant materials under creep-fatigue conditions. In ASTM Special Technical Publication (Vol. 1297, pp. 87-101). American Society for Testing and Materials.

Analysis of the intergranular cracking process inside polycrystalline heat-resistant materials under creep-fatigue conditions. / Tada, Naoya; Zhou, Weisheng; Kitamura, Takayuki; Ohtani, Ryuichi.

ASTM Special Technical Publication. Vol. 1297 American Society for Testing and Materials, 1997. p. 87-101.

Research output: Chapter in Book/Report/Conference proceedingChapter

Tada, N, Zhou, W, Kitamura, T & Ohtani, R 1997, Analysis of the intergranular cracking process inside polycrystalline heat-resistant materials under creep-fatigue conditions. in ASTM Special Technical Publication. vol. 1297, American Society for Testing and Materials, pp. 87-101.
Tada N, Zhou W, Kitamura T, Ohtani R. Analysis of the intergranular cracking process inside polycrystalline heat-resistant materials under creep-fatigue conditions. In ASTM Special Technical Publication. Vol. 1297. American Society for Testing and Materials. 1997. p. 87-101
Tada, Naoya ; Zhou, Weisheng ; Kitamura, Takayuki ; Ohtani, Ryuichi. / Analysis of the intergranular cracking process inside polycrystalline heat-resistant materials under creep-fatigue conditions. ASTM Special Technical Publication. Vol. 1297 American Society for Testing and Materials, 1997. pp. 87-101
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