Analysis of direct current potential field around multiple random cracks

N. Tada; Y. Hayashi; T. Kitamura; R. Ohtani

doi:10.1007/BF00018526

Analysis of direct current potential field around multiple random cracks

N. Tada, Y. Hayashi, T. Kitamura, R. Ohtani

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

A method for evaluating the distribution of electrical potential around multiple through cracks is proposed. The method gives accurate potential values for cracks with different lengths at random positions by combining theoretical potential functions for a single crack in an infinite plate. The validity of the method is numerically confirmed with respect to problems of a single and three cracks existing in a square plate subjected to a current flow, and the method is applied to a problem of random cracks in an infinite plate.

Original language	English
Pages (from-to)	69-84
Number of pages	16
Journal	International Journal of Fracture
Volume	75
Issue number	1
DOIs	https://doi.org/10.1007/BF00018526
Publication status	Published - Jan 1 1996
Externally published	Yes

ASJC Scopus subject areas

Computational Mechanics
Modelling and Simulation
Mechanics of Materials

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10.1007/BF00018526

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@article{260a303392674e968e52356998d234d8,

title = "Analysis of direct current potential field around multiple random cracks",

abstract = "A method for evaluating the distribution of electrical potential around multiple through cracks is proposed. The method gives accurate potential values for cracks with different lengths at random positions by combining theoretical potential functions for a single crack in an infinite plate. The validity of the method is numerically confirmed with respect to problems of a single and three cracks existing in a square plate subjected to a current flow, and the method is applied to a problem of random cracks in an infinite plate.",

author = "N. Tada and Y. Hayashi and T. Kitamura and R. Ohtani",

year = "1996",

month = jan,

day = "1",

doi = "10.1007/BF00018526",

language = "English",

volume = "75",

pages = "69--84",

journal = "International Journal of Fracture",

issn = "0376-9429",

publisher = "Springer Netherlands",

number = "1",

}

TY - JOUR

T1 - Analysis of direct current potential field around multiple random cracks

AU - Tada, N.

AU - Hayashi, Y.

AU - Kitamura, T.

AU - Ohtani, R.

PY - 1996/1/1

Y1 - 1996/1/1

N2 - A method for evaluating the distribution of electrical potential around multiple through cracks is proposed. The method gives accurate potential values for cracks with different lengths at random positions by combining theoretical potential functions for a single crack in an infinite plate. The validity of the method is numerically confirmed with respect to problems of a single and three cracks existing in a square plate subjected to a current flow, and the method is applied to a problem of random cracks in an infinite plate.

AB - A method for evaluating the distribution of electrical potential around multiple through cracks is proposed. The method gives accurate potential values for cracks with different lengths at random positions by combining theoretical potential functions for a single crack in an infinite plate. The validity of the method is numerically confirmed with respect to problems of a single and three cracks existing in a square plate subjected to a current flow, and the method is applied to a problem of random cracks in an infinite plate.

UR - http://www.scopus.com/inward/record.url?scp=0040180680&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0040180680&partnerID=8YFLogxK

U2 - 10.1007/BF00018526

DO - 10.1007/BF00018526

M3 - Article

AN - SCOPUS:0040180680

SN - 0376-9429

VL - 75

SP - 69

EP - 84

JO - International Journal of Fracture

JF - International Journal of Fracture

IS - 1

ER -

Analysis of direct current potential field around multiple random cracks

Abstract

ASJC Scopus subject areas

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