Abstract
To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.
| Original language | English |
|---|---|
| Article number | 63571N |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 6357 I |
| DOIs | |
| Publication status | Published - Dec 1 2006 |
| Event | Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence - Beijing, China Duration: Oct 13 2006 → Oct 15 2006 |
Keywords
- Ball grid array
- Image analysis
- Tomography
- X-ray
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering