Analysis of BGA defects by tomographic images

T. Sumimoto; T. Maruyama; Y. Azuma; S. Goto; M. Mondou; N. Furukawa; S. Okada

doi:10.1117/12.716986

Analysis of BGA defects by tomographic images

T. Sumimoto, T. Maruyama, Y. Azuma, S. Goto, M. Mondou, N. Furukawa, S. Okada

Research output: Contribution to journal › Conference article › peer-review

Abstract

To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.

Original language	English
Article number	63571N
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	6357 I
DOIs	https://doi.org/10.1117/12.716986
Publication status	Published - Dec 1 2006
Event	Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence - Beijing, China Duration: Oct 13 2006 → Oct 15 2006

Keywords

Ball grid array
Image analysis
Tomography
X-ray

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.716986

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title = "Analysis of BGA defects by tomographic images",

abstract = "To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.",

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note = "Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence ; Conference date: 13-10-2006 Through 15-10-2006",

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T1 - Analysis of BGA defects by tomographic images

AU - Sumimoto, T.

AU - Maruyama, T.

AU - Azuma, Y.

AU - Goto, S.

AU - Mondou, M.

AU - Furukawa, N.

AU - Okada, S.

PY - 2006/12/1

Y1 - 2006/12/1

N2 - To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.

AB - To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.

KW - Ball grid array

KW - Image analysis

KW - Tomography

KW - X-ray

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T2 - Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence

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