Analysis of BGA defects by tomographic images

T. Sumimoto; Toshinori Maruyama; Y. Azuma; Sachiko Goto; M. Mondou; N. Furukawa; S. Okada

doi:10.1117/12.716986

Analysis of BGA defects by tomographic images

T. Sumimoto, Toshinori Maruyama, Y. Azuma, Sachiko Goto, M. Mondou, N. Furukawa, S. Okada

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.

Original language	English
Title of host publication	Proceedings of SPIE - The International Society for Optical Engineering
Volume	6357 I
DOIs	https://doi.org/10.1117/12.716986
Publication status	Published - 2006
Event	Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence - Beijing, China Duration: Oct 13 2006 → Oct 15 2006

Other

Other	Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence
Country	China
City	Beijing
Period	10/13/06 → 10/15/06

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Keywords

Ball grid array
Image analysis
Tomography
X-ray

ASJC Scopus subject areas

Electrical and Electronic Engineering
Condensed Matter Physics

Cite this

Sumimoto, T., Maruyama, T., Azuma, Y., Goto, S., Mondou, M., Furukawa, N., & Okada, S. (2006). Analysis of BGA defects by tomographic images. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 6357 I). [63571N] https://doi.org/10.1117/12.716986

Sumimoto, T, Maruyama, T, Azuma, Y, Goto, S, Mondou, M, Furukawa, N & Okada, S 2006, Analysis of BGA defects by tomographic images. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 6357 I, 63571N, Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence, Beijing, China, 10/13/06. https://doi.org/10.1117/12.716986

@inproceedings{fe4bab8510c643d2bac63341896578fa,

title = "Analysis of BGA defects by tomographic images",

abstract = "To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.",

keywords = "Ball grid array, Image analysis, Tomography, X-ray",

author = "T. Sumimoto and Toshinori Maruyama and Y. Azuma and Sachiko Goto and M. Mondou and N. Furukawa and S. Okada",

year = "2006",

doi = "10.1117/12.716986",

language = "English",

volume = "6357 I",

booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",

note = "Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence ; Conference date: 13-10-2006 Through 15-10-2006",

}

TY - GEN

T1 - Analysis of BGA defects by tomographic images

AU - Sumimoto, T.

AU - Maruyama, Toshinori

AU - Azuma, Y.

AU - Goto, Sachiko

AU - Mondou, M.

AU - Furukawa, N.

AU - Okada, S.

PY - 2006

Y1 - 2006

N2 - To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.

AB - To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.

KW - Ball grid array

KW - Image analysis

KW - Tomography

KW - X-ray

UR - http://www.scopus.com/inward/record.url?scp=33846586454&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33846586454&partnerID=8YFLogxK

U2 - 10.1117/12.716986

DO - 10.1117/12.716986

M3 - Conference contribution

AN - SCOPUS:33846586454

VL - 6357 I

BT - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence

Y2 - 13 October 2006 through 15 October 2006

ER -

Access to Document

10.1117/12.716986