Analysis of BGA defects by tomographic images

T. Sumimoto, Toshinori Maruyama, Y. Azuma, Sachiko Goto, M. Mondou, N. Furukawa, S. Okada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Volume6357 I
DOIs
Publication statusPublished - 2006
EventSixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence - Beijing, China
Duration: Oct 13 2006Oct 15 2006

Other

OtherSixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence
CountryChina
CityBeijing
Period10/13/0610/15/06

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Keywords

  • Ball grid array
  • Image analysis
  • Tomography
  • X-ray

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Sumimoto, T., Maruyama, T., Azuma, Y., Goto, S., Mondou, M., Furukawa, N., & Okada, S. (2006). Analysis of BGA defects by tomographic images. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 6357 I). [63571N] https://doi.org/10.1117/12.716986