TY - GEN
T1 - Active link mechanism for Physical Man-machine Interaction
AU - Ochi, Jumpei
AU - Hashimoto, Tatsuya
AU - Suzumori, Koichi
AU - Kanda, Takefumi
PY - 2003/1/1
Y1 - 2003/1/1
N2 - In this paper, newly developed interface devices, which realize Physical Man-machine Interaction (PMI) between machines and persons, are reported. Developed interface devices are an active tetrahedron and an active icosahedron realizing PMI. Nine-DOF micro spherical joints and pressure control pneumatic cylinders were developed to realize the active tetrahedron, while fifteen-DQF micro spherical joints are developed for active icosahedron. The tetrahedron successfully realizes "virtual touch"; the operators (eel actions, forces, and shapes of the virtual objects in PC and also move and deform them. Real time PMI is realized by using MSC.VisualNastran 4D. MSG. VisualNastran 4D is a mechanism analysis software, which can make motion analysis in real time. The active icosahedron realized to present shape of virtual object in PC simulated by MSC.visualNastra 4D, showing the potential of the devices as haptic interface.
AB - In this paper, newly developed interface devices, which realize Physical Man-machine Interaction (PMI) between machines and persons, are reported. Developed interface devices are an active tetrahedron and an active icosahedron realizing PMI. Nine-DOF micro spherical joints and pressure control pneumatic cylinders were developed to realize the active tetrahedron, while fifteen-DQF micro spherical joints are developed for active icosahedron. The tetrahedron successfully realizes "virtual touch"; the operators (eel actions, forces, and shapes of the virtual objects in PC and also move and deform them. Real time PMI is realized by using MSC.VisualNastran 4D. MSG. VisualNastran 4D is a mechanism analysis software, which can make motion analysis in real time. The active icosahedron realized to present shape of virtual object in PC simulated by MSC.visualNastra 4D, showing the potential of the devices as haptic interface.
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U2 - 10.1109/MHS.2003.1249923
DO - 10.1109/MHS.2003.1249923
M3 - Conference contribution
AN - SCOPUS:21244488443
T3 - MHS 2003 - Proceedings of 2003 International Symposium on Micromechatronics and Human Science
SP - 141
EP - 146
BT - MHS 2003 - Proceedings of 2003 International Symposium on Micromechatronics and Human Science
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - International Symposium on Micromechatronics and Human Science, MHS 2003
Y2 - 19 October 2003 through 22 October 2003
ER -