A new method of 'solid inking' and its application to direct patterning of InAs nanowire using dip-pen nanolithography

Tong Wang, Yoshiki Shimizu, Naoyuki Ishida, Hirobumi Ushijima

Research output: Contribution to journalArticle

Abstract

We report a new approach to creating a 'solid ink' and direct patterning of InAs nanowires on a Si substrate using dip-pen nanolithography (DPN). The normal method to prepare an 'ink' is a solutionbased process using sonication to liquidize nanoparticles, which we call 'liquid ink' in this paper. As ink-solution-based DPN patterning has been prevalent in most studies, herein we propose a new method, 'solid inking', by which the inking process is solution-free. In our work, InAs nanowires were transferred to an AFM tip by directly scanning the tip over an InAs nanowire wafer at humidity over 80%. By this method, the preparation of ink and the 'inking' process is combined into one step, and a large amount of nanowires can be collected onto the tip to ensure the formation of a continuous ink flow for the direct patterning.

Original languageEnglish
Pages (from-to)146-150
Number of pages5
JournalIEICE Transactions on Electronics
VolumeE94-C
Issue number2
DOIs
Publication statusPublished - Feb 2011
Externally publishedYes

Keywords

  • Dip-pen nanolithography
  • InAs nanowire
  • Patterning
  • Solid inking

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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