A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology

Takana Kaho; Yo Yamaguchi; Kazuhiro Uehara; Shinji Nagamine; Yasuhiro Toriyama; Toru Taniguchi

doi:10.1109/EMICC.2007.4412635

A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology

Takana Kaho, Yo Yamaguchi, Kazuhiro Uehara, Shinji Nagamine, Yasuhiro Toriyama, Toru Taniguchi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

10 Citations (Scopus)

Abstract

A highly integrated quasi-millimeter wave receiver chip that integrates 22 circuits on a 3 x 2.3 mm chip using three-dimensional MMIC (3D-MM1C) technology is presented. The receiver MMIC operates with an LO signal in the 2.7-3.1 GHz range. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO chain, resulting in an IF center frequency of 2.4 GHz. It can use low-cost VCOs and demodulators in a 2-3 GHz frequency band. The power dissipation of the MMIC is only 450 mW. It also achieved low noise (3.4 dB) and high gain (41 dB) at 26 GHz. Furthermore, it achieved a high dynamic range using two step attenuators in the RF and IF frequency bands with a new built-in inverter using an N-channel depression FET.

Original language	English
Title of host publication	European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007
Pages	12-15
Number of pages	4
DOIs	https://doi.org/10.1109/EMICC.2007.4412635
Publication status	Published - Dec 1 2007
Externally published	Yes
Event	European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007 - Munich, Germany Duration: Oct 8 2007 → Oct 12 2007

Publication series

Name	European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007

Other

Other	European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007
Country/Territory	Germany
City	Munich
Period	10/8/07 → 10/12/07

ASJC Scopus subject areas

Electrical and Electronic Engineering
Communication

Access to Document

10.1109/EMICC.2007.4412635

Cite this

Kaho, T., Yamaguchi, Y., Uehara, K., Nagamine, S., Toriyama, Y., & Taniguchi, T. (2007). A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology. In European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007 (pp. 12-15). [4412635] (European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007). https://doi.org/10.1109/EMICC.2007.4412635

A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology. / Kaho, Takana; Yamaguchi, Yo; Uehara, Kazuhiro et al.

European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007. 2007. p. 12-15 4412635 (European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kaho, T, Yamaguchi, Y, Uehara, K, Nagamine, S, Toriyama, Y & Taniguchi, T 2007, A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology. in European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007., 4412635, European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007, pp. 12-15, European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007, Munich, Germany, 10/8/07. https://doi.org/10.1109/EMICC.2007.4412635

Kaho T, Yamaguchi Y, Uehara K, Nagamine S, Toriyama Y, Taniguchi T. A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology. In European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007. 2007. p. 12-15. 4412635. (European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007). https://doi.org/10.1109/EMICC.2007.4412635

Kaho, Takana ; Yamaguchi, Yo ; Uehara, Kazuhiro et al. / A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology. European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007. 2007. pp. 12-15 (European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007).

@inproceedings{15d6315cb7b94fd387986d9963470f14,

title = "A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology",

abstract = "A highly integrated quasi-millimeter wave receiver chip that integrates 22 circuits on a 3 x 2.3 mm chip using three-dimensional MMIC (3D-MM1C) technology is presented. The receiver MMIC operates with an LO signal in the 2.7-3.1 GHz range. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO chain, resulting in an IF center frequency of 2.4 GHz. It can use low-cost VCOs and demodulators in a 2-3 GHz frequency band. The power dissipation of the MMIC is only 450 mW. It also achieved low noise (3.4 dB) and high gain (41 dB) at 26 GHz. Furthermore, it achieved a high dynamic range using two step attenuators in the RF and IF frequency bands with a new built-in inverter using an N-channel depression FET.",

author = "Takana Kaho and Yo Yamaguchi and Kazuhiro Uehara and Shinji Nagamine and Yasuhiro Toriyama and Toru Taniguchi",

year = "2007",

month = dec,

day = "1",

doi = "10.1109/EMICC.2007.4412635",

language = "English",

isbn = "2874870021",

series = "European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007",

pages = "12--15",

booktitle = "European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007",

note = "European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007 ; Conference date: 08-10-2007 Through 12-10-2007",

}

TY - GEN

T1 - A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology

AU - Kaho, Takana

AU - Yamaguchi, Yo

AU - Uehara, Kazuhiro

AU - Nagamine, Shinji

AU - Toriyama, Yasuhiro

AU - Taniguchi, Toru

PY - 2007/12/1

Y1 - 2007/12/1

N2 - A highly integrated quasi-millimeter wave receiver chip that integrates 22 circuits on a 3 x 2.3 mm chip using three-dimensional MMIC (3D-MM1C) technology is presented. The receiver MMIC operates with an LO signal in the 2.7-3.1 GHz range. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO chain, resulting in an IF center frequency of 2.4 GHz. It can use low-cost VCOs and demodulators in a 2-3 GHz frequency band. The power dissipation of the MMIC is only 450 mW. It also achieved low noise (3.4 dB) and high gain (41 dB) at 26 GHz. Furthermore, it achieved a high dynamic range using two step attenuators in the RF and IF frequency bands with a new built-in inverter using an N-channel depression FET.

AB - A highly integrated quasi-millimeter wave receiver chip that integrates 22 circuits on a 3 x 2.3 mm chip using three-dimensional MMIC (3D-MM1C) technology is presented. The receiver MMIC operates with an LO signal in the 2.7-3.1 GHz range. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO chain, resulting in an IF center frequency of 2.4 GHz. It can use low-cost VCOs and demodulators in a 2-3 GHz frequency band. The power dissipation of the MMIC is only 450 mW. It also achieved low noise (3.4 dB) and high gain (41 dB) at 26 GHz. Furthermore, it achieved a high dynamic range using two step attenuators in the RF and IF frequency bands with a new built-in inverter using an N-channel depression FET.

UR - http://www.scopus.com/inward/record.url?scp=48149112327&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=48149112327&partnerID=8YFLogxK

U2 - 10.1109/EMICC.2007.4412635

DO - 10.1109/EMICC.2007.4412635

M3 - Conference contribution

AN - SCOPUS:48149112327

SN - 2874870021

SN - 9782874870026

T3 - European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007

SP - 12

EP - 15

BT - European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007

T2 - European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007

Y2 - 8 October 2007 through 12 October 2007

ER -

A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology

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