A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology

Takana Kaho; Yo Yamaguchi; Kazuhiro Uehara; Shinji Nagamine; Yasuhiro Toriyama; Toru Taniguchi

doi:10.1109/EMICC.2007.4412635

A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology

Takana Kaho, Yo Yamaguchi, Kazuhiro Uehara, Shinji Nagamine, Yasuhiro Toriyama, Toru Taniguchi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

9 Citations (Scopus)

Abstract

A highly integrated quasi-millimeter wave receiver chip that integrates 22 circuits on a 3 x 2.3 mm chip using three-dimensional MMIC (3D-MM1C) technology is presented. The receiver MMIC operates with an LO signal in the 2.7-3.1 GHz range. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO chain, resulting in an IF center frequency of 2.4 GHz. It can use low-cost VCOs and demodulators in a 2-3 GHz frequency band. The power dissipation of the MMIC is only 450 mW. It also achieved low noise (3.4 dB) and high gain (41 dB) at 26 GHz. Furthermore, it achieved a high dynamic range using two step attenuators in the RF and IF frequency bands with a new built-in inverter using an N-channel depression FET.

Original language	English
Title of host publication	European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007
Pages	12-15
Number of pages	4
DOIs	https://doi.org/10.1109/EMICC.2007.4412635
Publication status	Published - 2007
Externally published	Yes
Event	European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007 - Munich, Germany Duration: Oct 8 2007 → Oct 12 2007

Other

Other	European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007
Country	Germany
City	Munich
Period	10/8/07 → 10/12/07

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ASJC Scopus subject areas

Electrical and Electronic Engineering
Communication

Cite this

Kaho, T., Yamaguchi, Y., Uehara, K., Nagamine, S., Toriyama, Y., & Taniguchi, T. (2007). A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology. In European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007 (pp. 12-15). [4412635] https://doi.org/10.1109/EMICC.2007.4412635

A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology. / Kaho, Takana; Yamaguchi, Yo; Uehara, Kazuhiro; Nagamine, Shinji; Toriyama, Yasuhiro; Taniguchi, Toru.

European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007. 2007. p. 12-15 4412635.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kaho, T, Yamaguchi, Y, Uehara, K, Nagamine, S, Toriyama, Y & Taniguchi, T 2007, A highly integrated quasi-millimeter wave receiver chip using 3D-MMIC technology. in European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007., 4412635, pp. 12-15, European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007, Munich, Germany, 10/8/07. https://doi.org/10.1109/EMICC.2007.4412635

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abstract = "A highly integrated quasi-millimeter wave receiver chip that integrates 22 circuits on a 3 x 2.3 mm chip using three-dimensional MMIC (3D-MM1C) technology is presented. The receiver MMIC operates with an LO signal in the 2.7-3.1 GHz range. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO chain, resulting in an IF center frequency of 2.4 GHz. It can use low-cost VCOs and demodulators in a 2-3 GHz frequency band. The power dissipation of the MMIC is only 450 mW. It also achieved low noise (3.4 dB) and high gain (41 dB) at 26 GHz. Furthermore, it achieved a high dynamic range using two step attenuators in the RF and IF frequency bands with a new built-in inverter using an N-channel depression FET.",

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Access to Document

10.1109/EMICC.2007.4412635