A compact K/Ka-band transceiver MMIC using GaAs 3D-MMIC technology

Takana Kaho, Yo Yamaguchi, Kazuhiro Uehara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A highly integrated K and Ka-band transceiver MMIC that integrates 33 circuits in a 3 mm 3 mm area using three-dimensional MMIC (3D-MMIC) technology is presented. It achieved a noise figure of 3.4 dB and a conversion gain of 39 dB at 25 GHz in the receive mode. It also achieved a high P1dB of 8 dBm and a conversion gain of 29 dB at 25 GHz in the transmit mode. The power dissipation of the MMIC is only 0.34 W in the receive mode and 0.38 W in the transmit mode. It also integrates a frequency doubler, a single-pole/double-through (SPDT) amplifier for local oscillator (LO) signals, and step attenuators with built-in inverters using N-channel depression HEMTs. The attenuators make it possible to control receiver gain and transmitting power, and thermal noise reduction to the receiver block.

Original languageEnglish
Title of host publication2010 Asia-Pacific Microwave Conference Proceedings, APMC 2010
Pages822-825
Number of pages4
Publication statusPublished - Dec 1 2010
Externally publishedYes
Event2010 Asia-Pacific Microwave Conference, APMC 2010 - Yokohama, Japan
Duration: Dec 7 2010Dec 10 2010

Publication series

NameAsia-Pacific Microwave Conference Proceedings, APMC

Other

Other2010 Asia-Pacific Microwave Conference, APMC 2010
Country/TerritoryJapan
CityYokohama
Period12/7/1012/10/10

Keywords

  • 3D MMIC
  • FWA
  • GaAs
  • SPDT switch
  • WIPAS
  • quasi-millimeter wave
  • transceiver

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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