A bonding study toward the quality assurance of Belle-II silicon vertex detector modules

K. H. Kang, H. B. Jeon, H. Park, Satoru Uozumi, K. Adamczyk, H. Aihara, C. Angelini, T. Aziz, V. Babu, S. Bacher, S. Bahinipati, E. Barberio, T. Baroncelli, A. K. Basith, G. Batignani, A. Bauer, P. K. Behera, T. Bergauer, S. Bettarini, B. Bhuyan & 76 others T. Bilka, F. Bosi, L. Bosisio, A. Bozek, F. Buchsteiner, G. Casarosa, M. Ceccanti, D. Červenkov, S. R. Chendvankar, N. Dash, S. T. Divekar, Z. Doležal, D. Dutta, F. Forti, M. Friedl, K. Hara, T. Higuchi, T. Horiguchi, C. Irmler, A. Ishikawa, C. W. Joo, J. Kandra, E. Kato, T. Kawasaki, P. Kodyš, T. Kohriki, S. Koike, M. M. Kolwalkar, P. Kvasnička, L. Lanceri, J. Lettenbicher, P. Mammini, S. N. Mayekar, G. B. Mohanty, S. Mohanty, T. Morii, K. R. Nakamura, Z. Natkaniec, K. Negishi, N. K. Nisar, Y. Onuki, W. Ostrowicz, A. Paladino, E. Paoloni, F. Pilo, A. Profeti, K. K. Rao, I. Rashevskaia, G. Rizzo, M. Rozanska, S. Sandilya, J. Sasaki, N. Sato, S. Schultschik, C. Schwanda, Y. Seino, N. Shimizu, J. Stypula, S. Tanaka, K. Tanida, G. N. Taylor, R. Thalmeier, R. Thomas, T. Tsuboyama, P. Urquijo, L. Vitale, M. Volpi, S. Watanuki, I. J. Watson, J. Webb, J. Wiechczynski, S. Williams, B. Würkner, H. Yamamoto, H. Yin, T. Yoshinobu

Research output: Contribution to journalArticle

Abstract

A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor "Origami" method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.

Fingerprint

Silicon detectors
assurance
Quality assurance
apexes
modules
adapters
sensors
detectors
Sensors
Ladders
silicon
ladders
strip
chips
Detectors
Silicon
carbon fibers
fans
budgets
Fans

Keywords

  • Belle-II
  • DSSD
  • Origami
  • Pitch adapter
  • SVD
  • Wire bonding

ASJC Scopus subject areas

  • Instrumentation
  • Nuclear and High Energy Physics

Cite this

A bonding study toward the quality assurance of Belle-II silicon vertex detector modules. / Kang, K. H.; Jeon, H. B.; Park, H.; Uozumi, Satoru; Adamczyk, K.; Aihara, H.; Angelini, C.; Aziz, T.; Babu, V.; Bacher, S.; Bahinipati, S.; Barberio, E.; Baroncelli, T.; Basith, A. K.; Batignani, G.; Bauer, A.; Behera, P. K.; Bergauer, T.; Bettarini, S.; Bhuyan, B.; Bilka, T.; Bosi, F.; Bosisio, L.; Bozek, A.; Buchsteiner, F.; Casarosa, G.; Ceccanti, M.; Červenkov, D.; Chendvankar, S. R.; Dash, N.; Divekar, S. T.; Doležal, Z.; Dutta, D.; Forti, F.; Friedl, M.; Hara, K.; Higuchi, T.; Horiguchi, T.; Irmler, C.; Ishikawa, A.; Joo, C. W.; Kandra, J.; Kato, E.; Kawasaki, T.; Kodyš, P.; Kohriki, T.; Koike, S.; Kolwalkar, M. M.; Kvasnička, P.; Lanceri, L.; Lettenbicher, J.; Mammini, P.; Mayekar, S. N.; Mohanty, G. B.; Mohanty, S.; Morii, T.; Nakamura, K. R.; Natkaniec, Z.; Negishi, K.; Nisar, N. K.; Onuki, Y.; Ostrowicz, W.; Paladino, A.; Paoloni, E.; Pilo, F.; Profeti, A.; Rao, K. K.; Rashevskaia, I.; Rizzo, G.; Rozanska, M.; Sandilya, S.; Sasaki, J.; Sato, N.; Schultschik, S.; Schwanda, C.; Seino, Y.; Shimizu, N.; Stypula, J.; Tanaka, S.; Tanida, K.; Taylor, G. N.; Thalmeier, R.; Thomas, R.; Tsuboyama, T.; Urquijo, P.; Vitale, L.; Volpi, M.; Watanuki, S.; Watson, I. J.; Webb, J.; Wiechczynski, J.; Williams, S.; Würkner, B.; Yamamoto, H.; Yin, H.; Yoshinobu, T.

In: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 01.11.2015.

Research output: Contribution to journalArticle

Kang, KH, Jeon, HB, Park, H, Uozumi, S, Adamczyk, K, Aihara, H, Angelini, C, Aziz, T, Babu, V, Bacher, S, Bahinipati, S, Barberio, E, Baroncelli, T, Basith, AK, Batignani, G, Bauer, A, Behera, PK, Bergauer, T, Bettarini, S, Bhuyan, B, Bilka, T, Bosi, F, Bosisio, L, Bozek, A, Buchsteiner, F, Casarosa, G, Ceccanti, M, Červenkov, D, Chendvankar, SR, Dash, N, Divekar, ST, Doležal, Z, Dutta, D, Forti, F, Friedl, M, Hara, K, Higuchi, T, Horiguchi, T, Irmler, C, Ishikawa, A, Joo, CW, Kandra, J, Kato, E, Kawasaki, T, Kodyš, P, Kohriki, T, Koike, S, Kolwalkar, MM, Kvasnička, P, Lanceri, L, Lettenbicher, J, Mammini, P, Mayekar, SN, Mohanty, GB, Mohanty, S, Morii, T, Nakamura, KR, Natkaniec, Z, Negishi, K, Nisar, NK, Onuki, Y, Ostrowicz, W, Paladino, A, Paoloni, E, Pilo, F, Profeti, A, Rao, KK, Rashevskaia, I, Rizzo, G, Rozanska, M, Sandilya, S, Sasaki, J, Sato, N, Schultschik, S, Schwanda, C, Seino, Y, Shimizu, N, Stypula, J, Tanaka, S, Tanida, K, Taylor, GN, Thalmeier, R, Thomas, R, Tsuboyama, T, Urquijo, P, Vitale, L, Volpi, M, Watanuki, S, Watson, IJ, Webb, J, Wiechczynski, J, Williams, S, Würkner, B, Yamamoto, H, Yin, H & Yoshinobu, T 2015, 'A bonding study toward the quality assurance of Belle-II silicon vertex detector modules', Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. https://doi.org/10.1016/j.nima.2016.03.075
Kang, K. H. ; Jeon, H. B. ; Park, H. ; Uozumi, Satoru ; Adamczyk, K. ; Aihara, H. ; Angelini, C. ; Aziz, T. ; Babu, V. ; Bacher, S. ; Bahinipati, S. ; Barberio, E. ; Baroncelli, T. ; Basith, A. K. ; Batignani, G. ; Bauer, A. ; Behera, P. K. ; Bergauer, T. ; Bettarini, S. ; Bhuyan, B. ; Bilka, T. ; Bosi, F. ; Bosisio, L. ; Bozek, A. ; Buchsteiner, F. ; Casarosa, G. ; Ceccanti, M. ; Červenkov, D. ; Chendvankar, S. R. ; Dash, N. ; Divekar, S. T. ; Doležal, Z. ; Dutta, D. ; Forti, F. ; Friedl, M. ; Hara, K. ; Higuchi, T. ; Horiguchi, T. ; Irmler, C. ; Ishikawa, A. ; Joo, C. W. ; Kandra, J. ; Kato, E. ; Kawasaki, T. ; Kodyš, P. ; Kohriki, T. ; Koike, S. ; Kolwalkar, M. M. ; Kvasnička, P. ; Lanceri, L. ; Lettenbicher, J. ; Mammini, P. ; Mayekar, S. N. ; Mohanty, G. B. ; Mohanty, S. ; Morii, T. ; Nakamura, K. R. ; Natkaniec, Z. ; Negishi, K. ; Nisar, N. K. ; Onuki, Y. ; Ostrowicz, W. ; Paladino, A. ; Paoloni, E. ; Pilo, F. ; Profeti, A. ; Rao, K. K. ; Rashevskaia, I. ; Rizzo, G. ; Rozanska, M. ; Sandilya, S. ; Sasaki, J. ; Sato, N. ; Schultschik, S. ; Schwanda, C. ; Seino, Y. ; Shimizu, N. ; Stypula, J. ; Tanaka, S. ; Tanida, K. ; Taylor, G. N. ; Thalmeier, R. ; Thomas, R. ; Tsuboyama, T. ; Urquijo, P. ; Vitale, L. ; Volpi, M. ; Watanuki, S. ; Watson, I. J. ; Webb, J. ; Wiechczynski, J. ; Williams, S. ; Würkner, B. ; Yamamoto, H. ; Yin, H. ; Yoshinobu, T. / A bonding study toward the quality assurance of Belle-II silicon vertex detector modules. In: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 2015.
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TY - JOUR

T1 - A bonding study toward the quality assurance of Belle-II silicon vertex detector modules

AU - Kang, K. H.

AU - Jeon, H. B.

AU - Park, H.

AU - Uozumi, Satoru

AU - Adamczyk, K.

AU - Aihara, H.

AU - Angelini, C.

AU - Aziz, T.

AU - Babu, V.

AU - Bacher, S.

AU - Bahinipati, S.

AU - Barberio, E.

AU - Baroncelli, T.

AU - Basith, A. K.

AU - Batignani, G.

AU - Bauer, A.

AU - Behera, P. K.

AU - Bergauer, T.

AU - Bettarini, S.

AU - Bhuyan, B.

AU - Bilka, T.

AU - Bosi, F.

AU - Bosisio, L.

AU - Bozek, A.

AU - Buchsteiner, F.

AU - Casarosa, G.

AU - Ceccanti, M.

AU - Červenkov, D.

AU - Chendvankar, S. R.

AU - Dash, N.

AU - Divekar, S. T.

AU - Doležal, Z.

AU - Dutta, D.

AU - Forti, F.

AU - Friedl, M.

AU - Hara, K.

AU - Higuchi, T.

AU - Horiguchi, T.

AU - Irmler, C.

AU - Ishikawa, A.

AU - Joo, C. W.

AU - Kandra, J.

AU - Kato, E.

AU - Kawasaki, T.

AU - Kodyš, P.

AU - Kohriki, T.

AU - Koike, S.

AU - Kolwalkar, M. M.

AU - Kvasnička, P.

AU - Lanceri, L.

AU - Lettenbicher, J.

AU - Mammini, P.

AU - Mayekar, S. N.

AU - Mohanty, G. B.

AU - Mohanty, S.

AU - Morii, T.

AU - Nakamura, K. R.

AU - Natkaniec, Z.

AU - Negishi, K.

AU - Nisar, N. K.

AU - Onuki, Y.

AU - Ostrowicz, W.

AU - Paladino, A.

AU - Paoloni, E.

AU - Pilo, F.

AU - Profeti, A.

AU - Rao, K. K.

AU - Rashevskaia, I.

AU - Rizzo, G.

AU - Rozanska, M.

AU - Sandilya, S.

AU - Sasaki, J.

AU - Sato, N.

AU - Schultschik, S.

AU - Schwanda, C.

AU - Seino, Y.

AU - Shimizu, N.

AU - Stypula, J.

AU - Tanaka, S.

AU - Tanida, K.

AU - Taylor, G. N.

AU - Thalmeier, R.

AU - Thomas, R.

AU - Tsuboyama, T.

AU - Urquijo, P.

AU - Vitale, L.

AU - Volpi, M.

AU - Watanuki, S.

AU - Watson, I. J.

AU - Webb, J.

AU - Wiechczynski, J.

AU - Williams, S.

AU - Würkner, B.

AU - Yamamoto, H.

AU - Yin, H.

AU - Yoshinobu, T.

PY - 2015/11/1

Y1 - 2015/11/1

N2 - A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor "Origami" method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.

AB - A silicon vertex detector (SVD) for the Belle-II experiment comprises four layers of double-sided silicon strip detectors (DSSDs), assembled in a ladder-like structure. Each ladder module of the outermost SVD layer has four rectangular and one trapezoidal DSSDs supported by two carbon-fiber ribs. In order to achieve a good signal-to-noise ratio and minimize material budget, a novel chip-on-sensor "Origami" method has been employed for the three rectangular sensors that are sandwiched between the backward rectangular and forward (slanted) trapezoidal sensors. This paper describes the bonding procedures developed for making electrical connections between sensors and signal fan-out flex circuits (i.e., pitch adapters), and between pitch adapters and readout chips as well as the results in terms of the achieved bonding quality and pull force.

KW - Belle-II

KW - DSSD

KW - Origami

KW - Pitch adapter

KW - SVD

KW - Wire bonding

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U2 - 10.1016/j.nima.2016.03.075

DO - 10.1016/j.nima.2016.03.075

M3 - Article

JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

SN - 0168-9002

ER -