TY - GEN
T1 - 60-GHz microstrip antenna with stacked rings using multi-layer LTCC substrate
AU - Seki, Tomohiro
AU - Hiraga, Ken
AU - Nishikawa, Kenjiro
AU - Uehara, Kazuhiro
PY - 2009
Y1 - 2009
N2 - This paper proposes a novel high-gain millimeter-wave microstrip array antenna formed on a multi-layer low temperature co-fired ceramic (LTCC) substrate. The proposed antenna employs a microstrip antenna with stacked rings. This paper describes the design and characteristics of the proposed antenna. The antenna performance is also calculated by using electro-magnetic simulation. The thickness of the proposed antenna is 0.5 mm and the proposed antenna achieves the antenna gain of 13.3 dBi in calculation at a 60-GHz band. Moreover, we confirmed a good agreement of an calculated results and the measured results in the radiation pattern and achieved the absolute gain of 9.4 dBi with the measuring loss of the RF probe that is about 1.1 dB at 56 GHz. It is clear that the proposed antenna is suited for compact and low-profile millimeter-wave system-on-package.
AB - This paper proposes a novel high-gain millimeter-wave microstrip array antenna formed on a multi-layer low temperature co-fired ceramic (LTCC) substrate. The proposed antenna employs a microstrip antenna with stacked rings. This paper describes the design and characteristics of the proposed antenna. The antenna performance is also calculated by using electro-magnetic simulation. The thickness of the proposed antenna is 0.5 mm and the proposed antenna achieves the antenna gain of 13.3 dBi in calculation at a 60-GHz band. Moreover, we confirmed a good agreement of an calculated results and the measured results in the radiation pattern and achieved the absolute gain of 9.4 dBi with the measuring loss of the RF probe that is about 1.1 dB at 56 GHz. It is clear that the proposed antenna is suited for compact and low-profile millimeter-wave system-on-package.
KW - Active integrated antenna
KW - Microstrip antenna with stackd lings
KW - Millimeter-wave frequency band
KW - Multi-layer LTCC substrate
KW - System-on-package
UR - http://www.scopus.com/inward/record.url?scp=70349881724&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70349881724&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:70349881724
SN - 9783000245732
T3 - European Conference on Antennas and Propagation, EuCAP 2009, Proceedings
SP - 3797
EP - 3800
BT - European Conference on Antennas and Propagation, EuCAP 2009, Proceedings
T2 - 3rd European Conference on Antennas and Propagation, EuCAP 2009
Y2 - 23 March 2009 through 27 March 2009
ER -